US20080029132A1 - Ultrasonic cleaning apparatus - Google Patents
Ultrasonic cleaning apparatus Download PDFInfo
- Publication number
- US20080029132A1 US20080029132A1 US11/870,272 US87027207A US2008029132A1 US 20080029132 A1 US20080029132 A1 US 20080029132A1 US 87027207 A US87027207 A US 87027207A US 2008029132 A1 US2008029132 A1 US 2008029132A1
- Authority
- US
- United States
- Prior art keywords
- ultrasonic
- ultrasonic wave
- lens
- cleaning liquid
- transducer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/04—Cleaning involving contact with liquid
- B08B3/10—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration
- B08B3/12—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration by sonic or ultrasonic vibrations
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S134/00—Cleaning and liquid contact with solids
- Y10S134/902—Semiconductor wafer
Definitions
- the present invention relates to an ultrasonic cleaning apparatus for cleaning materials such as a semiconductor substrate and glass substrate at a surface by using ultrasonic waves.
- a process of manufacturing substrates such as semiconductor substrate and glass substrate includes a cleaning step of eliminating particles adhering to the surface of a substrate.
- an ultrasonic cleaning apparatus is used, which eliminates particles adhering to the surface of the substrate by applying an ultrasonic wave to a cleaning liquid.
- a nozzle type and a slit type are known as an ultrasonic cleaning apparatus.
- a nozzle type ultrasonic cleaning apparatus cleans a material at a surface while rotating the material on a rotary table, and has a cylindrical cleaning head provided substantially vertical in the upper surface side of the material.
- a slit type ultrasonic cleaning apparatus cleans a material at a surface while conveying the material by a conveying unit such as rollers, and has a bar-shaped cleaning head provided horizontally in the upper surface side of the material, so as to cross the material conveying direction.
- These cleaning heads has a liquid chamber inside to store a cleaning liquid, a nozzle or slit on the lower surface to eject the cleaning liquid, and an ultrasonic transducer outside the upper surface to apply an ultrasonic wave to the cleaning liquid in the cleaning chamber.
- the ultrasonic cleaning apparatus configured as above has an ultrasonic transducer on the upper surface of the cleaning head, and it is necessary to keep the liquid chamber filled with a cleaning liquid to apply an ultrasonic wave generated by the ultrasonic transducer to the cleaning liquid. Further, it is necessary to keep the liquid chamber filled with a cleaning liquid to prevent deterioration of the ultrasonic transducer by heat.
- the ultrasonic cleaning apparatus supplies a cleaning liquid to an upper surface of a material to be cleaned, and applies an ultrasonic wave to the cleaning liquid on the upper surface of the material.
- the ultrasonic cleaning apparatus has a cylindrical ultrasonic wave application head.
- the ultrasonic wave application head is provided substantially vertical to the upper surface of the material, and has an ultrasonic lens as a diffusion application means at the lower end, an ultrasonic transducer to generate an ultrasonic wave inside, and a nozzle to supply a cleaning liquid to the upper surface of a material outside.
- the ultrasonic lens transmits the ultrasonic wave generated by the ultrasonic transducer to the cleaning liquid on the upper surface of the material, and has inside a path to flow a cooling liquid to cool the ultrasonic transducer.
- the lower surface of the ultrasonic lens is curved to swell toward the upper surface of the material to diffuse and apply the ultrasonic wave generated by the ultrasonic transducer to a wide area of the cleaning liquid.
- ultrasonic wave is applied directly from the ultrasonic lens to the cleaning liquid supplied to the surface of the material.
- the material can be cleaned with the least minimum cleaning liquid, and the amount of the cleaning liquid with which the material is cleaned can be decreased. Further, the ultrasonic transducer can be cooled by flowing a cooling liquid in the path provided in the ultrasonic lens.
- One end of the ultrasonic lens is expanded in the diameter, and the expanded end face has a block made of material with high thermal conductivity such as copper.
- a path to flow a cooling liquid is formed inside the block, and an ultrasonic transducer is provided on the outside surface of the block.
- an ultrasonic wave generated by the ultrasonic transducer is transmitted to the ultrasonic lens through the block, and vibrates the ultrasonic lens laterally or in the direction crossing the axial line. This lateral vibration is transmitted to the cleaning liquid between the ultrasonic lens and the material, and used to clean the material at an upper surface.
- an ultrasonic wave generated by an ultrasonic transducer may reflect at an upper surface of a material to be cleaned and enter an ultrasonic transducer through an ultrasonic lens.
- the ultrasonic transducer When an ultrasonic wave enters an ultrasonic transducer, the ultrasonic transducer is extremely heated exceeding the cooling effect of a cooling liquid then, the polarization of the ultrasonic transducer may be deteriorated. In this case, the ultrasonic transducer cannot generate an ultrasonic wave with a constant intensity, and decreases the cleaning efficiency.
- the ultrasonic wave generated by the ultrasonic transducer is applied to the cleaning liquid after converting to vibration in the lateral direction of the ultrasonic lens, and the intensity of the ultrasonic wave applied to the cleaning liquid is decreased. Further, since the vibration in the lateral direction of the ultrasonic lens advances radially around the axial line of the ultrasonic lens, or toward all directions of the radius of the ultrasonic lens, the ultrasonic vibration toward the upper side where no cleaning liquid exists is not effectively used for cleaning the material.
- an ultrasonic cleaning apparatus comprising an ultrasonic wave application head which cleans a material at a surface by applying an ultrasonic wave to a cleaning liquid supplied to the surface of the material.
- the ultrasonic wave application head has an ultrasonic wave transmission member which is placed opposite to the surface and has a curved portion on a first plane placed close to the surface; an ultrasonic transducer which is provided on a second plane opposite to the first plane of the ultrasonic transmission member, and generates and applies an ultrasonic wave to a cleaning liquid on the surface through the ultrasonic wave transmission member; and a preventive portion which is provided in the ultrasonic wave transmission member, and prevents the ultrasonic wave applied to the cleaning liquid and reflected on the surface from entering the ultrasonic transducer through the ultrasonic wave transmission member.
- an ultrasonic cleaning apparatus comprising an ultrasonic wave application head which cleans a material at a surface by applying an ultrasonic wave to a cleaning liquid supplied to the surface of the material.
- the ultrasonic wave application head has an ultrasonic wave transmission member which is placed opposite to the surface and has a curved portion on a first plane placed close to the surface; an ultrasonic transducer which is provided on a second plane opposite to the first plane of the ultrasonic transmission member, and generates and applies an ultrasonic wave to the liquid on the surface through the first plane of the ultrasonic wave transmission member; and a preventive portion which is provided in the ultrasonic wave transmission member, and prevents the ultrasonic wave generated by the ultrasonic transducer from exiting to the cleaning liquid on the surface at a substantially right angle to the surface.
- an ultrasonic cleaning apparatus comprising an ultrasonic wave application head which cleans a material at a surface by applying an ultrasonic wave to a cleaning liquid supplied to the surface of the material.
- the ultrasonic wave application head has a cylindrical ultrasonic wave transmission member with a first plane faced to the surface, and an ultrasonic transducer which is provided on a second plane opposite to the first plane of the ultrasonic wave transmission member, and applies an ultrasonic wave to the cleaning liquid on the surface through the ultrasonic wave transmission member,
- an ultrasonic cleaning apparatus comprising an ultrasonic wave application head which cleans a material at a surface by applying an ultrasonic wave to a cleaning liquid supplied to the surface of the material.
- the ultrasonic wave application head has a bar-shaped ultrasonic wave transmission member which is placed with an axial line parallel to the surface and a first plane faced to the surface; and an ultrasonic transducer which is provided on a second plane opposite to the first plane of the ultrasonic transmission member, and generates and applies an ultrasonic wave to a cleaning liquid on the surface through the ultrasonic wave transmission member, wherein a portion of the first plane of the ultrasonic wave transmission member closest to the surface is formed as two linear lines which are located on both sides of a axial line of the ultrasonic wave transmission member respectively.
- FIG. 1 is a view showing the configuration of an ultrasonic cleaning apparatus according to a first embodiment of the present invention
- FIG. 2 is a view showing the configuration of an ultrasonic wave application head according to the embodiment
- FIG. 3A is a graph showing the intensity distribution of an ultrasonic wave measured under an ultrasonic lens with a notch according to the embodiment
- FIG. 3B is a graph showing the intensity distribution of an ultrasonic wave measured under an ultrasonic lens without a notch according to the embodiment
- FIG. 4A is gradation showing the intensity distribution of an ultrasonic wave measured under an ultrasonic lens with a notch according to the embodiment
- FIG. 4B is gradation showing the intensity distribution of an ultrasonic wave measured under an ultrasonic lens without a notch according to the embodiment
- FIG. 5 is a graph showing the temperatures of an ultrasonic transducer according to the embodiment measured by supplying power continuously to the ultrasonic transducer;
- FIG. 6 is a graph showing the temperatures of an ultrasonic transducer according to the embodiment measured by supplying power intermittently to the ultrasonic transducer;
- FIG. 7 is a graph showing the voltage standing wave ratio VSWR when power is continuously supplied to the ultrasonic transducer according to the embodiment.
- FIG. 8 is a view showing the configuration of an ultrasonic wave application head according to a modification of the embodiment.
- FIG. 9 is a perspective view of an ultrasonic cleaning apparatus according to a second embodiment of the present invention.
- FIG. 10 is a perspective view of an ultrasonic lens according to a modification of the embodiment.
- FIG. 1 - FIG. 8 A first embodiment of the present invention will be explained first with reference to FIG. 1 - FIG. 8 .
- FIG. 1 is a view showing the configuration of an ultrasonic cleaning apparatus according to a first embodiment of the present invention.
- the ultrasonic cleaning apparatus comprises a spin processing unit 10 which holds and rotates a material S such as a semiconductor substrate and glass substrate, and an ultrasonic cleaning unit 20 which supplies a cleaning liquid L to the material S, applies an ultrasonic wave to the cleaning liquid L, and cleans the surface of the material S.
- a spin processing unit 10 which holds and rotates a material S such as a semiconductor substrate and glass substrate
- an ultrasonic cleaning unit 20 which supplies a cleaning liquid L to the material S, applies an ultrasonic wave to the cleaning liquid L, and cleans the surface of the material S.
- the spin processing unit 10 has a cylindrical cup body 11 with a bottom.
- the cup body 11 has an opening 11 a facing upward, and has ejection ports 12 on the bottom 11 b to eject the cleaning liquid L after the cleaning step.
- a motor 13 is provided under the cup body 11 .
- a driving shaft 13 a of the motor 13 penetrates the bottom wall of the cup body 11 , and the mid portion of the shaft 13 a is rotatably held by a bearing 14 .
- a rotary table 15 is provided almost horizontally at the upper end of the driving shaft 13 a .
- Support pins 16 are provided with equal intervals on the upper surface periphery of the rotary table 15 .
- the support pins 16 engage with the periphery of the material S, and support the material S substantially horizontally.
- the ultrasonic cleaning unit 20 has an ultrasonic wave application head 21 .
- the ultrasonic wave application head 21 is placed opposite to the surface of the material S, and can reciprocate on the surface by driving a swing arm 22 .
- FIG. 2 is a view showing the configuration of the ultrasonic wave application head 21 according to the embodiment.
- the ultrasonic wave application head 21 has a head main body 21 a .
- the head main body 21 a is formed like a flat plate, and has an opening 21 b faced to the surface of the material S.
- a cylindrical ultrasonic lens 23 (ultrasonic transmission member) is provided inside the head main body 21 a .
- the ultrasonic lens 23 is made of SiO2, for example.
- the lower end of the ultrasonic lens 23 projects from the opening 21 b of the head main body 21 a to the surface of the material S.
- the lower end face 23 a (first plane) opposite to the surface of the material S is composed of a curved portion projecting to the surface as it comes close to the radial center.
- the vertical thickness of the ultrasonic lens 23 is set to have the highest intensity of an ultrasonic wave generated by an ultrasonic transducer 25 (described later) in the ring-like area around an axial line I of the ultrasonic lens 23 when the intensity is measured under the ultrasonic lens 23 .
- a notch 24 (preventive portion) is formed at the radial center of the lower end face 23 a of the ultrasonic lens 23 .
- the notch 24 is formed by oblique planes 24 b inclined to the axial line I of the ultrasonic lens 23 , and formed conical with the diameter becoming small as it goes upward in this embodiment.
- the circular area around the axial line I of the lower end face 23 a of the ultra-sonic lens 23 becomes closest to the material S.
- the ultrasonic transducer 25 is fixed with adhesive to the upper end face 23 c (second surface) of the ultrasonic lens 23 .
- the ultrasonic transducer 25 is made of lead titanate, for example, and generates an ultrasonic wave by receiving power from a power supply unit 27 .
- the ultrasonic transducer 25 may also be made of piezoelectric element.
- a matching circuit 28 is provided between the power supply unit 27 and ultrasonic transducer 25 .
- the matching circuit 28 matches the impedance between the power supply unit 27 and ultrasonic transducer 25 , and is previously adjusted to convert the power from the power supply unit 27 most effectively into an ultra-sonic wave in the ultrasonic transducer 25 .
- a nozzle body 26 is provided in the periphery of the head main body 21 a .
- the distal end of the nozzle body 26 is faced to between the lower end face 23 a of the ultrasonic lens 23 and the surface of the material S, so that it can supply the cleaning liquid L such as hydrofluoric acid to the surface of the material S.
- a cooling tube (not shown) is provided around the ultrasonic lens 23 .
- the cooling tube flows a cooling liquid supplied from a cooling liquid source (not shown), and can cool the ultrasonic transducer 25 heated by generating an ultrasonic wave.
- the material S When the material S is supported by the support pins 16 on the rotary table 15 , the material S is rotated in the circumferential direction by the rotary table 15 and the cleaning liquid L is supplied from the nozzle body 26 to the surface of the material S.
- the ultrasonic transducer 25 When the cleaning liquid L is filled between the ultrasonic lens 23 and the surface of the material S, the ultrasonic transducer 25 is driven and an ultra-sonic wave is applied from the ultrasonic lens 23 to the cleaning liquid L on the surface of the material S.
- the ultrasonic wave is difficult to reach the cleaning liquid L near the radial center of the ultrasonic lens 23 .
- the intensity of the ultrasonic wave applied to the cleaning liquid L is decreased near the radial center of the ultrasonic lens 23 , compared with that in the surrounding area.
- those applied to the cleaning liquid L not through the radial center of the ultrasonic lens 23 are refracted radially around the axial line of the ultrasonic lens 23 on the curved surface formed on the lower end face 23 a of the ultrasonic lens 23 , and applied to a wide area of the cleaning liquid L.
- the ultrasonic wave generated by the ultrasonic transducer 25 is prevented from exiting from the ultrasonic lens 23 substantially perpendicular to the surface of the material S, by the notch 24 and curved surface formed on the lower end face 23 a of the ultrasonic lens 23 .
- FIG. 3A is a graph showing the intensity distribution of the ultrasonic wave measured under the ultrasonic lens 23 with the notch 24 according to the embodiment.
- FIG. 3B is a graph showing the intensity distribution of the ultrasonic wave measured under the ultrasonic lens 23 without the notch 24 according to the embodiment.
- the solid line indicates an RMS value
- the chain line indicates a peak value
- the dotted line indicates the radial center of the ultrasonic lens 23 .
- the measuring conditions are as follows.
- the intensity of an ultrasonic wave is decreased near the radial center of the ultrasonic lens 23 by providing the notch 24 at the radial center on the lower end face 23 a of the ultrasonic lens 23 .
- FIG. 4A is gradation showing the intensity distribution of the ultrasonic wave measured under the ultrasonic lens 23 with the notch 24 according to the embodiment.
- FIG. 4B is gradation showing the intensity distribution of the ultrasonic wave measured under the ultrasonic lens 23 without the notch 24 according to the embodiment.
- the measuring conditions are as follows.
- the intensity of an ultrasonic wave is decreased near the radial center of the ultrasonic lens 23 by providing the notch 24 at the radial center on the lower end face 23 a of the ultrasonic lens 23 . It is also seen that the intensity of an ultrasonic wave is increased in the circular area around the radial center of the ultrasonic lens 23 by adjusting the vertical thickness of the ultrasonic lens 23 .
- the ultrasonic wave applied to the cleaning liquid L is reflected on that surface of the material S and transmitted to the ultrasonic lens 23 (this ultrasonic wave is called a reflected wave hereinafter).
- the ultrasonic wave reflected on the surface is prevented from entering the ultrasonic lens 23 through the ultrasonic lens 23 , by the notch 24 and curved surface formed on the lower end face 23 a of the ultrasonic lens 23 .
- the ultrasonic transducer 25 is not extremely heated by absorbing a reflected wave, deterioration of polarization is suppressed, and stable cleaning effect can be obtained for a long period of time.
- FIG. 5 is a graph showing the temperatures of the ultrasonic transducer 25 according to the embodiment measured by supplying power continuously to the ultrasonic transducer 25 .
- the solid line indicates the case when the notch 24 is formed in the ultrasonic lens 23
- the chain line indicates the case when the notch 24 is not formed.
- the sign A indicates the case when power of 10[W] is supplied to the ultrasonic transducer 25
- B indicates the case when power of 20[W] is supplied to the ultrasonic transducer 25
- C indicates the case when power of 30[W] is supplied to the ultrasonic transducer 25 , respectively.
- the measuring conditions are as follows.
- FIG. 6 is a graph showing the temperatures of the ultrasonic transducer 25 according to the embodiment measured by supplying power intermittently to the ultrasonic transducer 25 .
- the solid line indicates the case when the notch 24 is formed in the ultrasonic lens 23
- the chain line indicates the case when the notch 24 is not formed.
- the measuring conditions are as follows.
- the temperature of the ultrasonic transducer 25 when the notch 24 is formed on the lower end face 23 a of the ultrasonic lens 23 is about 20% lower than the case when the notch 24 is not formed.
- the ultrasonic transducer 25 is driven with the matching circuit 28 kept in the optimum matching state by initial setting, and a desired cleaning effect can be held.
- FIG. 7 is a graph showing the voltage standing wave ratio VSWR when power is continuously supplied to the ultrasonic transducer 25 according to the embodiment.
- the solid line indicates the case when the notch 24 is formed in the ultrasonic lens 23
- the chain line indicates the case when the notch 24 is not formed.
- FIG. 8 is a view showing the configuration of an ultrasonic wave application head 21 A according to a modification of the embodiment. As shown in FIG. 8 , a space 24 A is taken on the axial line I of the ultrasonic lens 23 in this modification, instead of forming the notch 24 on the lower end surface 23 a of the ultrasonic lens 23 .
- the ultrasonic wave generated by the ultrasonic transducer 25 is prevented from being applied to the cleaning liquid L through the radial center of the ultrasonic lens 23 , and the ultrasonic wave reflected on the surface is prevented from entering the ultrasonic transducer 25 through the ultrasonic lens 23 .
- a second embodiment of the present invention will be explained with reference to FIG. 9 and FIG. 10 .
- the same components and effects as those of the first embodiment will be omitted.
- FIG. 9 is a perspective view of an ultrasonic cleaning apparatus according to a second embodiment of the present invention.
- the ultrasonic cleaning apparatus comprises a conveying unit 31 which conveys a material S such as a semiconductor substrate and glass substrate, and an ultrasonic wave application head 32 which supplies a cleaning liquid L to the material S conveyed by the conveying unit 31 , applies an ultrasonic wave to the cleaning liquid L, and cleans the surface of the material S.
- a conveying unit 31 which conveys a material S such as a semiconductor substrate and glass substrate
- an ultrasonic wave application head 32 which supplies a cleaning liquid L to the material S conveyed by the conveying unit 31 , applies an ultrasonic wave to the cleaning liquid L, and cleans the surface of the material S.
- the ultrasonic wave application head 32 has a head man body 32 a .
- the head main body 32 a is formed like a long plate, and has an opening 32 b faced to the surface of the material S.
- a bar-shaped ultrasonic lens 33 is provided horizontally inside the head main body 21 a .
- the ultrasonic lens 33 is made of SiO2, for example.
- the lower end of the ultrasonic lens 33 projects from the opening 32 b of the head main body 32 a to the surface of the material S.
- the lower end face 33 a opposite to the surface of the material S is composed of a curved portion projecting to the surface of the material S as it comes close to the radial center.
- the vertical thickness of the ultrasonic lens 33 is set to have the highest intensity of an ultrasonic wave generated by an ultrasonic transducer 35 (described later) in the belt-like two areas located on both sides of the center in the width direction of the ultrasonic lens 33 respectively when the intensity is measured under the ultrasonic lens 33 .
- a notch 34 (preventive portion) is formed along the axial line m of the ultrasonic lens 33 , at the radial center of the lower end face 33 a of the ultrasonic lens 33 .
- the notch 34 is formed by two oblique planes 34 b inclined to the surface of the material S, and formed like a wedge with the diameter becoming small as it goes upward in this embodiment.
- the ultrasonic transducer 35 is fixed with adhesive to the upper end face 33 b of the ultrasonic lens 33 .
- the ultrasonic transducer 35 is made of lead titanate, for example, and generates an ultrasonic wave by receiving power from a power supply unit 37 .
- the ultrasonic transducer 35 may also be made of piezoelectric element.
- a matching circuit 38 is provided between the power supply unit 37 and ultrasonic transducer 35 .
- the matching circuit 38 matches the impedance between the power supply unit 37 and ultrasonic transducer 35 , and is previously adjusted so that the power from the power supply unit 37 is most effectively converted to an ultrasonic wave in the ultrasonic transducer 35 .
- a cooling tube (not shown) is provided around the ultrasonic lens 33 .
- the cooling tube is connected to a cooling liquid supply source (not shown), flows a cooling liquid from the cooling liquid source, and cools the ultrasonic transducer 35 heated by generating an ultrasonic wave.
- FIG. 10 is a perspective view of an ultrasonic lens according to a modification of the embodiment. As shown in FIG. 10 , an elliptical space 34 A (preventive portion) passing through the center of width direction is taken inside the ultrasonic lens 23 in this modification, instead of forming the notch 34 on the lower end surface 33 a of the ultrasonic lens 33 .
- the ultrasonic wave generated by the ultrasonic transducer 35 is prevented from being applied to the cleaning liquid L through the center of width direction of the ultrasonic lens 33 , and the ultrasonic wave reflected on the surface of the material S is prevented from entering the ultrasonic transducer 35 through the ultrasonic lens 33 .
- the present invention is not limited to the above-mentioned embodiments.
- the invention may be embodied by modifying the components without departing from its essential characteristics.
- the invention may also be embodied in various forms by combining the components disclosed in the above-mentioned embodiments. For example, some components may be deleted from the components used in the above-mentioned embodiments. It is also possible to combine the components which are used in different embodiments.
- the ultrasonic transducer 25 may be provided at the position other than on the upper end face 33 b of the ultrasonic lens 23 , and the ultrasonic wave generated by the ultrasonic transducer 25 may be reflected on the reflection surface provided in the ultrasonic lens 23 and applied to the cleaning liquid L on the surface of the material. Even with this configuration, the same effects as the above-mentioned embodiments can be obtained.
Abstract
An ultrasonic cleaning apparatus which cleans a material at a surface by supplying an ultrasonic wave from an ultrasonic wave application head to a cleaning liquid on the surface, and cleans the surface, wherein the ultrasonic wave application head has an ultrasonic wave transmission member which is provided opposite the surface, and has a curved portion on a first plane placed close to the surface, an ultrasonic transducer which is provided on a second plane placed opposite the first plane of the ultrasonic wave transmission member, and generates and applies an ultrasonic wave to a cleaning liquid on the surface through the ultrasonic wave transmission member, and a preventive portion which is provided in the ultrasonic wave transmission member, and prevents the ultrasonic wave applied to the cleaning liquid and reflected on the surface from entering the ultrasonic transducer through the ultrasonic wave transmission member.
Description
- This application is a continuation of and claims the benefit of priority under 35 U.S.C. §120 for U.S. Ser. No. 11/159,199, filed Jun. 23, 2005, which is based upon and claims the benefit of priority from prior Japanese Patent Application No. 2004-186500, filed Jun. 24, 2004, the entire contents of each are incorporated herein by reference.
- 1. Field of the Invention
- The present invention relates to an ultrasonic cleaning apparatus for cleaning materials such as a semiconductor substrate and glass substrate at a surface by using ultrasonic waves.
- 2. Description of the Related Art
- A process of manufacturing substrates such as semiconductor substrate and glass substrate includes a cleaning step of eliminating particles adhering to the surface of a substrate. In this cleaning step, an ultrasonic cleaning apparatus is used, which eliminates particles adhering to the surface of the substrate by applying an ultrasonic wave to a cleaning liquid.
- Generally, a nozzle type and a slit type are known as an ultrasonic cleaning apparatus. A nozzle type ultrasonic cleaning apparatus cleans a material at a surface while rotating the material on a rotary table, and has a cylindrical cleaning head provided substantially vertical in the upper surface side of the material.
- A slit type ultrasonic cleaning apparatus cleans a material at a surface while conveying the material by a conveying unit such as rollers, and has a bar-shaped cleaning head provided horizontally in the upper surface side of the material, so as to cross the material conveying direction.
- These cleaning heads has a liquid chamber inside to store a cleaning liquid, a nozzle or slit on the lower surface to eject the cleaning liquid, and an ultrasonic transducer outside the upper surface to apply an ultrasonic wave to the cleaning liquid in the cleaning chamber.
- In the ultrasonic cleaning apparatus configured as above has an ultrasonic transducer on the upper surface of the cleaning head, and it is necessary to keep the liquid chamber filled with a cleaning liquid to apply an ultrasonic wave generated by the ultrasonic transducer to the cleaning liquid. Further, it is necessary to keep the liquid chamber filled with a cleaning liquid to prevent deterioration of the ultrasonic transducer by heat.
- However, if the liquid chamber is filled with a cleaning liquid, the cleaning liquid more than the necessary quantity is ejected from the nozzle or slit and much cleaning liquid is wasted.
- To solve the above problem, an ultrasonic cleaning apparatus has been developed in recent years, (Jpn. Pat. Appln. KOKAI Publication No. 2003-31540).
- The ultrasonic cleaning apparatus supplies a cleaning liquid to an upper surface of a material to be cleaned, and applies an ultrasonic wave to the cleaning liquid on the upper surface of the material.
- The ultrasonic cleaning apparatus has a cylindrical ultrasonic wave application head. The ultrasonic wave application head is provided substantially vertical to the upper surface of the material, and has an ultrasonic lens as a diffusion application means at the lower end, an ultrasonic transducer to generate an ultrasonic wave inside, and a nozzle to supply a cleaning liquid to the upper surface of a material outside.
- The ultrasonic lens transmits the ultrasonic wave generated by the ultrasonic transducer to the cleaning liquid on the upper surface of the material, and has inside a path to flow a cooling liquid to cool the ultrasonic transducer. The lower surface of the ultrasonic lens is curved to swell toward the upper surface of the material to diffuse and apply the ultrasonic wave generated by the ultrasonic transducer to a wide area of the cleaning liquid.
- According to the ultrasonic cleaning apparatus configured as above, ultrasonic wave is applied directly from the ultrasonic lens to the cleaning liquid supplied to the surface of the material.
- Therefore, the material can be cleaned with the least minimum cleaning liquid, and the amount of the cleaning liquid with which the material is cleaned can be decreased. Further, the ultrasonic transducer can be cooled by flowing a cooling liquid in the path provided in the ultrasonic lens.
- As an ultrasonic cleaning apparatus of the type similar to the above, there is a known ultrasonic cleaning apparatus, in which a cylindrical ultrasonic lens is provided parallel or substantially parallel to a material to be cleaned.
- One end of the ultrasonic lens is expanded in the diameter, and the expanded end face has a block made of material with high thermal conductivity such as copper. A path to flow a cooling liquid is formed inside the block, and an ultrasonic transducer is provided on the outside surface of the block.
- In this ultrasonic cleaning apparatus, an ultrasonic wave generated by the ultrasonic transducer is transmitted to the ultrasonic lens through the block, and vibrates the ultrasonic lens laterally or in the direction crossing the axial line. This lateral vibration is transmitted to the cleaning liquid between the ultrasonic lens and the material, and used to clean the material at an upper surface.
- However, if an ultrasonic wave is applied to a cleaning liquid by using an ultrasonic lens as described above, an ultrasonic wave generated by an ultrasonic transducer may reflect at an upper surface of a material to be cleaned and enter an ultrasonic transducer through an ultrasonic lens.
- When an ultrasonic wave enters an ultrasonic transducer, the ultrasonic transducer is extremely heated exceeding the cooling effect of a cooling liquid then, the polarization of the ultrasonic transducer may be deteriorated. In this case, the ultrasonic transducer cannot generate an ultrasonic wave with a constant intensity, and decreases the cleaning efficiency.
- On the other hand, in the ultrasonic cleaning apparatus in which a bar-shaped ultrasonic lens is provided parallel to a material to be cleaned and an ultrasonic transducer is provided at one end of the lens, an ultrasonic wave transmission route is not straight, and an ultrasonic wave reflected on the material hardly reaches the ultrasonic transducer.
- However, in this ultrasonic cleaning apparatus, the ultrasonic wave generated by the ultrasonic transducer is applied to the cleaning liquid after converting to vibration in the lateral direction of the ultrasonic lens, and the intensity of the ultrasonic wave applied to the cleaning liquid is decreased. Further, since the vibration in the lateral direction of the ultrasonic lens advances radially around the axial line of the ultrasonic lens, or toward all directions of the radius of the ultrasonic lens, the ultrasonic vibration toward the upper side where no cleaning liquid exists is not effectively used for cleaning the material.
- According to an aspect of the present invention, there is provided an ultrasonic cleaning apparatus comprising an ultrasonic wave application head which cleans a material at a surface by applying an ultrasonic wave to a cleaning liquid supplied to the surface of the material. The ultrasonic wave application head has an ultrasonic wave transmission member which is placed opposite to the surface and has a curved portion on a first plane placed close to the surface; an ultrasonic transducer which is provided on a second plane opposite to the first plane of the ultrasonic transmission member, and generates and applies an ultrasonic wave to a cleaning liquid on the surface through the ultrasonic wave transmission member; and a preventive portion which is provided in the ultrasonic wave transmission member, and prevents the ultrasonic wave applied to the cleaning liquid and reflected on the surface from entering the ultrasonic transducer through the ultrasonic wave transmission member.
- According to another aspect of the present invention, there is provided an ultrasonic cleaning apparatus comprising an ultrasonic wave application head which cleans a material at a surface by applying an ultrasonic wave to a cleaning liquid supplied to the surface of the material. The ultrasonic wave application head has an ultrasonic wave transmission member which is placed opposite to the surface and has a curved portion on a first plane placed close to the surface; an ultrasonic transducer which is provided on a second plane opposite to the first plane of the ultrasonic transmission member, and generates and applies an ultrasonic wave to the liquid on the surface through the first plane of the ultrasonic wave transmission member; and a preventive portion which is provided in the ultrasonic wave transmission member, and prevents the ultrasonic wave generated by the ultrasonic transducer from exiting to the cleaning liquid on the surface at a substantially right angle to the surface.
- According to another aspect of the present invention, there is provided an ultrasonic cleaning apparatus comprising an ultrasonic wave application head which cleans a material at a surface by applying an ultrasonic wave to a cleaning liquid supplied to the surface of the material. The ultrasonic wave application head has a cylindrical ultrasonic wave transmission member with a first plane faced to the surface, and an ultrasonic transducer which is provided on a second plane opposite to the first plane of the ultrasonic wave transmission member, and applies an ultrasonic wave to the cleaning liquid on the surface through the ultrasonic wave transmission member,
- wherein a portion of the first plane of the ultrasonic wave transmission member closest to the surface is circular surrounding the axial line of the ultrasonic wave transmission member.
- According to another aspect of the present invention, there is provided an ultrasonic cleaning apparatus comprising an ultrasonic wave application head which cleans a material at a surface by applying an ultrasonic wave to a cleaning liquid supplied to the surface of the material. The ultrasonic wave application head has a bar-shaped ultrasonic wave transmission member which is placed with an axial line parallel to the surface and a first plane faced to the surface; and an ultrasonic transducer which is provided on a second plane opposite to the first plane of the ultrasonic transmission member, and generates and applies an ultrasonic wave to a cleaning liquid on the surface through the ultrasonic wave transmission member, wherein a portion of the first plane of the ultrasonic wave transmission member closest to the surface is formed as two linear lines which are located on both sides of a axial line of the ultrasonic wave transmission member respectively.
- According to the aspects of the present invention, a high cleaning efficiency can be obtained.
- Additional aspects and advantages of the invention will be set forth in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. The aspects and advantages of the invention may be realized and obtained by means of the instrumentalities and combinations particularly pointed out hereinafter.
- The accompanying drawings, which are incorporated in and constitute a part of the specification, illustrate embodiments of the invention, and together with the general description given above and the detailed description of the embodiments given below, serve to explain the principles of the invention.
-
FIG. 1 is a view showing the configuration of an ultrasonic cleaning apparatus according to a first embodiment of the present invention; -
FIG. 2 is a view showing the configuration of an ultrasonic wave application head according to the embodiment; -
FIG. 3A is a graph showing the intensity distribution of an ultrasonic wave measured under an ultrasonic lens with a notch according to the embodiment; -
FIG. 3B is a graph showing the intensity distribution of an ultrasonic wave measured under an ultrasonic lens without a notch according to the embodiment; -
FIG. 4A is gradation showing the intensity distribution of an ultrasonic wave measured under an ultrasonic lens with a notch according to the embodiment; -
FIG. 4B is gradation showing the intensity distribution of an ultrasonic wave measured under an ultrasonic lens without a notch according to the embodiment; -
FIG. 5 is a graph showing the temperatures of an ultrasonic transducer according to the embodiment measured by supplying power continuously to the ultrasonic transducer; -
FIG. 6 is a graph showing the temperatures of an ultrasonic transducer according to the embodiment measured by supplying power intermittently to the ultrasonic transducer; -
FIG. 7 is a graph showing the voltage standing wave ratio VSWR when power is continuously supplied to the ultrasonic transducer according to the embodiment; -
FIG. 8 is a view showing the configuration of an ultrasonic wave application head according to a modification of the embodiment; -
FIG. 9 is a perspective view of an ultrasonic cleaning apparatus according to a second embodiment of the present invention; and -
FIG. 10 is a perspective view of an ultrasonic lens according to a modification of the embodiment. - Description will be given of the best mode for carrying out the present invention.
- A first embodiment of the present invention will be explained first with reference to
FIG. 1 -FIG. 8 . - [Configuration of Ultrasonic Cleaning Apparatus]
-
FIG. 1 is a view showing the configuration of an ultrasonic cleaning apparatus according to a first embodiment of the present invention. - As shown in
FIG. 1 , the ultrasonic cleaning apparatus comprises aspin processing unit 10 which holds and rotates a material S such as a semiconductor substrate and glass substrate, and anultrasonic cleaning unit 20 which supplies a cleaning liquid L to the material S, applies an ultrasonic wave to the cleaning liquid L, and cleans the surface of the material S. - The
spin processing unit 10 has acylindrical cup body 11 with a bottom. Thecup body 11 has anopening 11 a facing upward, and hasejection ports 12 on the bottom 11 b to eject the cleaning liquid L after the cleaning step. - A
motor 13 is provided under thecup body 11. A drivingshaft 13 a of themotor 13 penetrates the bottom wall of thecup body 11, and the mid portion of theshaft 13 a is rotatably held by abearing 14. - A rotary table 15 is provided almost horizontally at the upper end of the driving
shaft 13 a. Support pins 16 are provided with equal intervals on the upper surface periphery of the rotary table 15. The support pins 16 engage with the periphery of the material S, and support the material S substantially horizontally. - The
ultrasonic cleaning unit 20 has an ultrasonicwave application head 21. The ultrasonicwave application head 21 is placed opposite to the surface of the material S, and can reciprocate on the surface by driving aswing arm 22. - [Configuration of Ultrasonic Wave Application Head 21]
-
FIG. 2 is a view showing the configuration of the ultrasonicwave application head 21 according to the embodiment. - As shown in
FIG. 2 , the ultrasonicwave application head 21 has a headmain body 21 a. The headmain body 21 a is formed like a flat plate, and has anopening 21 b faced to the surface of the material S. - A cylindrical ultrasonic lens 23 (ultrasonic transmission member) is provided inside the head
main body 21 a. Theultrasonic lens 23 is made of SiO2, for example. The lower end of theultrasonic lens 23 projects from theopening 21 b of the headmain body 21 a to the surface of the material S. The lower end face 23 a (first plane) opposite to the surface of the material S is composed of a curved portion projecting to the surface as it comes close to the radial center. - The vertical thickness of the
ultrasonic lens 23 is set to have the highest intensity of an ultrasonic wave generated by an ultrasonic transducer 25 (described later) in the ring-like area around an axial line I of theultrasonic lens 23 when the intensity is measured under theultrasonic lens 23. - A notch 24 (preventive portion) is formed at the radial center of the lower end face 23 a of the
ultrasonic lens 23. Thenotch 24 is formed byoblique planes 24 b inclined to the axial line I of theultrasonic lens 23, and formed conical with the diameter becoming small as it goes upward in this embodiment. - As the
notch 24 is formed in theultrasonic lens 23 as described above, the circular area around the axial line I of the lower end face 23 a of theultra-sonic lens 23 becomes closest to the material S. - The
ultrasonic transducer 25 is fixed with adhesive to the upper end face 23 c (second surface) of theultrasonic lens 23. Theultrasonic transducer 25 is made of lead titanate, for example, and generates an ultrasonic wave by receiving power from apower supply unit 27. Theultrasonic transducer 25 may also be made of piezoelectric element. - A matching
circuit 28 is provided between thepower supply unit 27 andultrasonic transducer 25. The matchingcircuit 28 matches the impedance between thepower supply unit 27 andultrasonic transducer 25, and is previously adjusted to convert the power from thepower supply unit 27 most effectively into an ultra-sonic wave in theultrasonic transducer 25. - A
nozzle body 26 is provided in the periphery of the headmain body 21 a. The distal end of thenozzle body 26 is faced to between the lower end face 23 a of theultrasonic lens 23 and the surface of the material S, so that it can supply the cleaning liquid L such as hydrofluoric acid to the surface of the material S. - A cooling tube (not shown) is provided around the
ultrasonic lens 23. The cooling tube flows a cooling liquid supplied from a cooling liquid source (not shown), and can cool theultrasonic transducer 25 heated by generating an ultrasonic wave. - [Effects of Ultrasonic Cleaning Apparatus]
- Description will now be given on the effects when the ultrasonic cleaning apparatus configured as described above is used.
- When the material S is supported by the support pins 16 on the rotary table 15, the material S is rotated in the circumferential direction by the rotary table 15 and the cleaning liquid L is supplied from the
nozzle body 26 to the surface of the material S. - When the cleaning liquid L is filled between the
ultrasonic lens 23 and the surface of the material S, theultrasonic transducer 25 is driven and an ultra-sonic wave is applied from theultrasonic lens 23 to the cleaning liquid L on the surface of the material S. - Among the ultrasonic waves applied to the cleaning liquid L, those applied to the cleaning liquid L through the radial center of the
ultrasonic lens 23 are refracted at thenotch 24 formed on the lower end face 23 a of theultrasonic lens 23. - Thus, the ultrasonic wave is difficult to reach the cleaning liquid L near the radial center of the
ultrasonic lens 23. As a result, the intensity of the ultrasonic wave applied to the cleaning liquid L is decreased near the radial center of theultrasonic lens 23, compared with that in the surrounding area. - Among the ultrasonic waves applied to the cleaning liquid L, those applied to the cleaning liquid L not through the radial center of the
ultrasonic lens 23 are refracted radially around the axial line of theultrasonic lens 23 on the curved surface formed on the lower end face 23 a of theultrasonic lens 23, and applied to a wide area of the cleaning liquid L. - Namely, the ultrasonic wave generated by the
ultrasonic transducer 25 is prevented from exiting from theultrasonic lens 23 substantially perpendicular to the surface of the material S, by thenotch 24 and curved surface formed on the lower end face 23 a of theultrasonic lens 23. -
FIG. 3A is a graph showing the intensity distribution of the ultrasonic wave measured under theultrasonic lens 23 with thenotch 24 according to the embodiment.FIG. 3B is a graph showing the intensity distribution of the ultrasonic wave measured under theultrasonic lens 23 without thenotch 24 according to the embodiment. InFIG. 3 , the solid line indicates an RMS value, the chain line indicates a peak value, and the dotted line indicates the radial center of theultrasonic lens 23. - The measuring conditions are as follows.
- Generation frequency of ultrasonic wave: 1685[kHz]
- Cleaning liquid: Deaerated water
- Power supplied to the ultrasonic transducer 25: 15[W]
- Output waveform of ultrasonic wave: Continuous wave
- According to
FIG. 3A andFIG. 3B , it is seen that the intensity of an ultrasonic wave is decreased near the radial center of theultrasonic lens 23 by providing thenotch 24 at the radial center on the lower end face 23 a of theultrasonic lens 23. -
FIG. 4A is gradation showing the intensity distribution of the ultrasonic wave measured under theultrasonic lens 23 with thenotch 24 according to the embodiment.FIG. 4B is gradation showing the intensity distribution of the ultrasonic wave measured under theultrasonic lens 23 without thenotch 24 according to the embodiment. - The measuring conditions are as follows.
- Generation frequency of ultrasonic wave: 1685[kHz]
- Cleaning liquid: Deaerated water
- Power supplied to the ultrasonic transducer 25: 15[W]
- Measuring range: Square of 50×50 [mm]
- According also to
FIG. 4A andFIG. 4B , it is seen that the intensity of an ultrasonic wave is decreased near the radial center of theultrasonic lens 23 by providing thenotch 24 at the radial center on the lower end face 23 a of theultrasonic lens 23. It is also seen that the intensity of an ultrasonic wave is increased in the circular area around the radial center of theultrasonic lens 23 by adjusting the vertical thickness of theultrasonic lens 23. - The ultrasonic wave applied to the cleaning liquid L is reflected on that surface of the material S and transmitted to the ultrasonic lens 23 (this ultrasonic wave is called a reflected wave hereinafter).
- Among the ultrasonic waves reflected on the surface, those transmitted through the position out of the radial center of the ultrasonic lens are reflected outside the radial direction of the
ultrasonic lens 23 on the curved surface formed on the lower end face 23 a of theultrasonic lens 23, and most of them do not enter theultrasonic lens 23. - Among the ultrasonic waves reflected on the surface, those transmitted through the radial center of the
ultrasonic lens 23 are reflected at thenotch 24 formed on the lower end face 23 a of theultrasonic lens 23, and most of them do not reach theultrasonic transducer 25. Even if a part of the reflected wave enters theultrasonic lens 23, it is refracted when passing thorough thenotch 24 and hardly enter theultrasonic transducer 25 on theultrasonic lens 23. - Namely, the ultrasonic wave reflected on the surface is prevented from entering the
ultrasonic lens 23 through theultrasonic lens 23, by thenotch 24 and curved surface formed on the lower end face 23 a of theultrasonic lens 23. - Thus, the
ultrasonic transducer 25 is not extremely heated by absorbing a reflected wave, deterioration of polarization is suppressed, and stable cleaning effect can be obtained for a long period of time. -
FIG. 5 is a graph showing the temperatures of theultrasonic transducer 25 according to the embodiment measured by supplying power continuously to theultrasonic transducer 25. - In
FIG. 5 , the solid line indicates the case when thenotch 24 is formed in theultrasonic lens 23, and the chain line indicates the case when thenotch 24 is not formed. The sign A indicates the case when power of 10[W] is supplied to theultrasonic transducer 25, B indicates the case when power of 20[W] is supplied to theultrasonic transducer 25, and C indicates the case when power of 30[W] is supplied to theultrasonic transducer 25, respectively. - The measuring conditions are as follows.
- Generation frequency of ultrasonic wave: 1685[kHz]
- Cleaning liquid: Deaerated water
- Measuring position: Center of the ultrasonic transducer
- Sampling: 1[sec]
- Comparing the solid line and chain line in
FIG. 5 , it is seen in any case of A-C that the temperature of theultrasonic transducer 25 when thenotch 24 is formed in theultrasonic lens 23 is lower than the case when thenotch 24 is not formed. -
FIG. 6 is a graph showing the temperatures of theultrasonic transducer 25 according to the embodiment measured by supplying power intermittently to theultrasonic transducer 25. InFIG. 6 , the solid line indicates the case when thenotch 24 is formed in theultrasonic lens 23, and the chain line indicates the case when thenotch 24 is not formed. - The measuring conditions are as follows.
- Generation frequency of ultrasonic wave: 1685[kHz]
- Cleaning liquid: Deaerated water
- Power supplied to the ultrasonic transducer 25: 20[W]
- Measuring position: Center of the
ultrasonic transducer 25 - Sampling: 1[sec]
- Comparing the solid line and chain line in
FIG. 6 , it is seen that the temperature of theultrasonic transducer 25 when thenotch 24 is formed on the lower end face 23 a of theultrasonic lens 23 is about 20% lower than the case when thenotch 24 is not formed. - According to this experiment, it is seen that even if the
ultrasonic transducer 25 is intermittently driven as when actually cleaning the material S by using the ultrasonic cleaning apparatus, the temperature of theultrasonic transducer 25 is hardly increased when thenotch 24 is formed on the lower end face 23 a of theultrasonic lens 23, compared with the case when thenotch 24 is not formed. - Besides, if the ultrasonic wave reflected on the surface of the material S is hardly enter the
ultrasonic transducer 25 as in this embodiment, the impedance matching between theultrasonic transducer 25 andpower supply unit 27 is not disturbed by the reflected wave. Thus, theultrasonic transducer 25 is driven with the matchingcircuit 28 kept in the optimum matching state by initial setting, and a desired cleaning effect can be held. -
FIG. 7 is a graph showing the voltage standing wave ratio VSWR when power is continuously supplied to theultrasonic transducer 25 according to the embodiment. InFIG. 7 , the solid line indicates the case when thenotch 24 is formed in theultrasonic lens 23, and the chain line indicates the case when thenotch 24 is not formed. - Comparing the solid line and chain line in
FIG. 7 , it is seen that the voltage standing wave ratio VSWR when thenotch 24 is formed one the lower end face 23 a of theultrasonic lens 23 is lower than the case when thenotch 24 is not formed. This indicates that the power supplied from thepower supply unit 27 is effectively converted to an ultrasonic wave in theultrasonic transducer 25. - (Modification of the Embodiment)
-
FIG. 8 is a view showing the configuration of an ultrasonic wave application head 21A according to a modification of the embodiment. As shown inFIG. 8 , aspace 24A is taken on the axial line I of theultrasonic lens 23 in this modification, instead of forming thenotch 24 on thelower end surface 23 a of theultrasonic lens 23. - Even with this configuration, the ultrasonic wave generated by the
ultrasonic transducer 25 is prevented from being applied to the cleaning liquid L through the radial center of theultrasonic lens 23, and the ultrasonic wave reflected on the surface is prevented from entering theultrasonic transducer 25 through theultrasonic lens 23. - It is permitted to bury rubber or similar material on the axial line I of the
ultrasonic lens 23, instead of taking thespace 24A. The material should not be molten when absorbing an ultrasonic wave. - A second embodiment of the present invention will be explained with reference to
FIG. 9 andFIG. 10 . The same components and effects as those of the first embodiment will be omitted. - [Configuration of Ultrasonic Cleaning Apparatus]
-
FIG. 9 is a perspective view of an ultrasonic cleaning apparatus according to a second embodiment of the present invention. - As shown in
FIG. 9 , the ultrasonic cleaning apparatus according to this embodiment comprises a conveyingunit 31 which conveys a material S such as a semiconductor substrate and glass substrate, and an ultrasonicwave application head 32 which supplies a cleaning liquid L to the material S conveyed by the conveyingunit 31, applies an ultrasonic wave to the cleaning liquid L, and cleans the surface of the material S. - [Configuration of Ultrasonic Wave Application Head 32]
- The ultrasonic
wave application head 32 has ahead man body 32 a. The headmain body 32 a is formed like a long plate, and has anopening 32 b faced to the surface of the material S. - A bar-shaped
ultrasonic lens 33 is provided horizontally inside the headmain body 21 a. Theultrasonic lens 33 is made of SiO2, for example. The lower end of theultrasonic lens 33 projects from theopening 32 b of the headmain body 32 a to the surface of the material S. The lower end face 33 a opposite to the surface of the material S is composed of a curved portion projecting to the surface of the material S as it comes close to the radial center. - The vertical thickness of the
ultrasonic lens 33 is set to have the highest intensity of an ultrasonic wave generated by an ultrasonic transducer 35 (described later) in the belt-like two areas located on both sides of the center in the width direction of theultrasonic lens 33 respectively when the intensity is measured under theultrasonic lens 33. - A notch 34 (preventive portion) is formed along the axial line m of the
ultrasonic lens 33, at the radial center of the lower end face 33 a of theultrasonic lens 33. Thenotch 34 is formed by two oblique planes 34 b inclined to the surface of the material S, and formed like a wedge with the diameter becoming small as it goes upward in this embodiment. - As the
notch 34 is formed in theultrasonic lens 33 as described above, two linear areas which are located on both sides of the center of the width direction of theultrasonic lens 33 become closest to the material S. - The ultrasonic transducer 35 is fixed with adhesive to the upper end face 33 b of the
ultrasonic lens 33. The ultrasonic transducer 35 is made of lead titanate, for example, and generates an ultrasonic wave by receiving power from apower supply unit 37. The ultrasonic transducer 35 may also be made of piezoelectric element. - A matching
circuit 38 is provided between thepower supply unit 37 and ultrasonic transducer 35. The matchingcircuit 38 matches the impedance between thepower supply unit 37 and ultrasonic transducer 35, and is previously adjusted so that the power from thepower supply unit 37 is most effectively converted to an ultrasonic wave in the ultrasonic transducer 35. - A cooling tube (not shown) is provided around the
ultrasonic lens 33. The cooling tube is connected to a cooling liquid supply source (not shown), flows a cooling liquid from the cooling liquid source, and cools the ultrasonic transducer 35 heated by generating an ultrasonic wave. - The same effects of the first embodiment can be obtained, even if the
notch 34 is formed in the lower end face 33 a of the bar-shapedultrasonic lens 33 as in this embodiment. - (Modification of the Embodiment)
-
FIG. 10 is a perspective view of an ultrasonic lens according to a modification of the embodiment. As shown inFIG. 10 , anelliptical space 34A (preventive portion) passing through the center of width direction is taken inside theultrasonic lens 23 in this modification, instead of forming thenotch 34 on thelower end surface 33 a of theultrasonic lens 33. - Even with this configuration, the ultrasonic wave generated by the ultrasonic transducer 35 is prevented from being applied to the cleaning liquid L through the center of width direction of the
ultrasonic lens 33, and the ultrasonic wave reflected on the surface of the material S is prevented from entering the ultrasonic transducer 35 through theultrasonic lens 33. - It is permitted to bury rubber or similar material, instead of taking the
space 34A. The material should not be molten when absorbing an ultrasonic wave. - The present invention is not limited to the above-mentioned embodiments. The invention may be embodied by modifying the components without departing from its essential characteristics. The invention may also be embodied in various forms by combining the components disclosed in the above-mentioned embodiments. For example, some components may be deleted from the components used in the above-mentioned embodiments. It is also possible to combine the components which are used in different embodiments.
- For example, the
ultrasonic transducer 25 may be provided at the position other than on the upper end face 33 b of theultrasonic lens 23, and the ultrasonic wave generated by theultrasonic transducer 25 may be reflected on the reflection surface provided in theultrasonic lens 23 and applied to the cleaning liquid L on the surface of the material. Even with this configuration, the same effects as the above-mentioned embodiments can be obtained. - Additional advantages and modifications will readily occur to those skilled in the art. Therefore, the invention in its broader aspects is not limited to the specific details and representative embodiments shown and described herein. Accordingly, various modifications may be made without departing from the spirit or scope of the general inventive concept as defined by the appended claims and their equivalents.
Claims (1)
1. An ultrasonic cleaning apparatus comprising an ultrasonic wave application head which cleans a material at a surface by applying an ultrasonic wave to a cleaning liquid supplied to the surface, the ultrasonic wave application head comprising:
an ultrasonic wave transmission member which is placed opposite to the surface and has a curved portion on a first plane placed close to the surface;
an ultrasonic transducer which is provided on a second plane opposite to the first plane of the ultrasonic transmission member, and generates and applies an ultrasonic wave to the cleaning liquid on the surface through the ultrasonic wave transmission member; and
a preventive portion which is provided in the ultrasonic wave transmission member and prevents the ultrasonic wave applied to the cleaning liquid and reflected on the surface from entering the ultrasonic transducer through the ultrasonic wave transmission member.
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US11/870,272 US20080029132A1 (en) | 2004-06-24 | 2007-10-10 | Ultrasonic cleaning apparatus |
US12/248,514 US7814919B2 (en) | 2004-06-24 | 2008-10-09 | Ultrasonic cleaning apparatus |
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004186500A JP4519541B2 (en) | 2004-06-24 | 2004-06-24 | Ultrasonic cleaning equipment |
JP2004-186500 | 2004-06-24 | ||
US11/159,199 US20050284509A1 (en) | 2004-06-24 | 2005-06-23 | Ultrasonic cleaning apparatus |
US11/870,272 US20080029132A1 (en) | 2004-06-24 | 2007-10-10 | Ultrasonic cleaning apparatus |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US11/159,199 Continuation US20050284509A1 (en) | 2004-06-24 | 2005-06-23 | Ultrasonic cleaning apparatus |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US12/248,514 Continuation US7814919B2 (en) | 2004-06-24 | 2008-10-09 | Ultrasonic cleaning apparatus |
Publications (1)
Publication Number | Publication Date |
---|---|
US20080029132A1 true US20080029132A1 (en) | 2008-02-07 |
Family
ID=35504290
Family Applications (3)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US11/159,199 Abandoned US20050284509A1 (en) | 2004-06-24 | 2005-06-23 | Ultrasonic cleaning apparatus |
US11/870,272 Abandoned US20080029132A1 (en) | 2004-06-24 | 2007-10-10 | Ultrasonic cleaning apparatus |
US12/248,514 Active US7814919B2 (en) | 2004-06-24 | 2008-10-09 | Ultrasonic cleaning apparatus |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US11/159,199 Abandoned US20050284509A1 (en) | 2004-06-24 | 2005-06-23 | Ultrasonic cleaning apparatus |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US12/248,514 Active US7814919B2 (en) | 2004-06-24 | 2008-10-09 | Ultrasonic cleaning apparatus |
Country Status (5)
Country | Link |
---|---|
US (3) | US20050284509A1 (en) |
JP (1) | JP4519541B2 (en) |
KR (1) | KR100777854B1 (en) |
CN (1) | CN1712144B (en) |
TW (1) | TWI280161B (en) |
Families Citing this family (22)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101206776B1 (en) * | 2006-06-09 | 2012-11-30 | 주식회사 케이씨텍 | Priming roller cleaning unit and method, and substrate coating apparatus with the cleaner |
US8899247B2 (en) | 2006-09-22 | 2014-12-02 | Kaijo Corporation | Ultrasonic cleaning apparatus |
WO2008070295A2 (en) * | 2006-10-17 | 2008-06-12 | Akrion Technologies, Inc. | System and method for the sonic-assisted cleaning of substrates utilizing a sonic-treated liquid |
KR100840974B1 (en) * | 2007-08-07 | 2008-06-24 | 세메스 주식회사 | Apparatus for generating supersonic and apparatus for cleaning a substrate having the same |
KR100931856B1 (en) | 2007-08-24 | 2009-12-15 | 세메스 주식회사 | Substrate Cleaning Apparatus and Substrate Cleaning Method |
KR100887226B1 (en) * | 2007-09-19 | 2009-03-06 | 세메스 주식회사 | Apparatus and method for generating a supersonic vibration and apparatus and method of cleaning a wafer |
TWI394664B (en) * | 2009-07-01 | 2013-05-01 | Ind Tech Res Inst | Method and assembly for cleaning ink jet printhead |
JP5517227B2 (en) * | 2010-05-31 | 2014-06-11 | コリア・インスティテュート・オブ・マシナリー・アンド・マテリアルズ | Ultrasonic precision cleaning equipment |
US8595892B1 (en) | 2010-08-02 | 2013-12-03 | Wilson E. Everette, Jr. | Ultrasonic floor cleaner and scrubber |
TWI412222B (en) * | 2011-06-22 | 2013-10-11 | Datron Products Co Ltd | Piezoelectric vibrating device with heat dissipating and conducting means |
US9266117B2 (en) | 2011-09-20 | 2016-02-23 | Jo-Ann Reif | Process and system for treating particulate solids |
CN102553858A (en) * | 2011-11-23 | 2012-07-11 | 珠海市翔鹤电子有限公司 | Multipurpose ultrasonic cleaner |
CN102430543B (en) * | 2011-12-30 | 2016-06-01 | 上海集成电路研发中心有限公司 | The rinser of wafer and cleaning method |
US9192968B2 (en) | 2012-09-20 | 2015-11-24 | Wave Particle Processing | Process and system for treating particulate solids |
US10017842B2 (en) | 2013-08-05 | 2018-07-10 | Ut-Battelle, Llc | Creep-resistant, cobalt-containing alloys for high temperature, liquid-salt heat exchanger systems |
KR101576802B1 (en) | 2014-03-06 | 2015-12-21 | 주식회사 대경열처리 | A Cooling Apparaus for working piece |
US11141762B2 (en) | 2015-05-15 | 2021-10-12 | Acm Research (Shanghai), Inc. | System for cleaning semiconductor wafers |
WO2018053678A1 (en) | 2016-09-20 | 2018-03-29 | Acm Research (Shanghai) Inc. | Methods and apparatus for cleaning substrates |
WO2016183707A1 (en) * | 2015-05-15 | 2016-11-24 | Acm Research (Shanghai) Inc. | Methods and apparatus for cleaning semiconductor wafers |
EP3315973B1 (en) * | 2015-06-29 | 2023-05-24 | Hitachi High-Tech Corporation | Ultrasonic cleaning device and automatic analysis apparatus using same |
JP7111472B2 (en) * | 2018-01-25 | 2022-08-02 | 株式会社Screenホールディングス | Substrate processing method and substrate processing apparatus |
JP7364322B2 (en) * | 2018-02-23 | 2023-10-18 | 株式会社荏原製作所 | Substrate cleaning equipment and substrate cleaning method |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5078149A (en) * | 1989-09-29 | 1992-01-07 | Terumo Kabushiki Kaisha | Ultrasonic coupler and method for production thereof |
US6463938B2 (en) * | 1996-09-30 | 2002-10-15 | Verteq, Inc. | Wafer cleaning method |
US20030024547A1 (en) * | 2001-08-03 | 2003-02-06 | Bran Mario E. | Megasonic probe energy attenuator |
US6536452B1 (en) * | 1999-04-27 | 2003-03-25 | Tokyo Electron Limited | Processing apparatus and processing method |
US20040054288A1 (en) * | 2000-10-18 | 2004-03-18 | Nygaard Per Ehrenreich | Ultrasonic apparatus with rotatable probe, surrounded by a protective resilent sleeve |
US6875696B2 (en) * | 2002-05-23 | 2005-04-05 | Kabushiki Kaisha Toshiba | Ultrasonic-wave washing unit, ultrasonic-wave washing apparatus, ultrasonic-wave washing method, method of manufacturing a semiconductor device, and method of manufacturing a liquid crystal display |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2770795A (en) * | 1951-03-30 | 1956-11-13 | Raytheon Mfg Co | Acoustic log |
US3421939A (en) * | 1965-12-27 | 1969-01-14 | Branson Instr | Method and apparatus for cleaning a pipe with sonic energy |
US4178188A (en) * | 1977-09-14 | 1979-12-11 | Branson Ultrasonics Corporation | Method for cleaning workpieces by ultrasonic energy |
JPH08141528A (en) * | 1994-11-28 | 1996-06-04 | Kaijo Corp | Ultrasonic horn for washing inner wall surface |
US6524251B2 (en) * | 1999-10-05 | 2003-02-25 | Omnisonics Medical Technologies, Inc. | Ultrasonic device for tissue ablation and sheath for use therewith |
JP2002086068A (en) * | 2000-09-18 | 2002-03-26 | Toshiba Corp | Ultrasonic vibration unit, ultrasonic cleaner, and ultrasonic cleaning method |
JP4868667B2 (en) * | 2001-07-18 | 2012-02-01 | 株式会社東芝 | Ultrasonic cleaning unit, ultrasonic cleaning device, ultrasonic cleaning method, method for manufacturing semiconductor device, and method for manufacturing liquid crystal display device |
KR100493016B1 (en) * | 2002-03-23 | 2005-06-07 | 삼성전자주식회사 | Megasonic cleaning apparatus for fabricating semiconductor device |
US6843257B2 (en) * | 2002-04-25 | 2005-01-18 | Samsung Electronics Co., Ltd. | Wafer cleaning system |
JP4474883B2 (en) | 2003-09-29 | 2010-06-09 | パナソニック電工株式会社 | Ultrasonic biological cleaning equipment |
-
2004
- 2004-06-24 JP JP2004186500A patent/JP4519541B2/en not_active Expired - Fee Related
-
2005
- 2005-06-22 TW TW094120722A patent/TWI280161B/en not_active IP Right Cessation
- 2005-06-23 US US11/159,199 patent/US20050284509A1/en not_active Abandoned
- 2005-06-23 KR KR1020050054217A patent/KR100777854B1/en active IP Right Grant
- 2005-06-24 CN CN2005100823847A patent/CN1712144B/en active Active
-
2007
- 2007-10-10 US US11/870,272 patent/US20080029132A1/en not_active Abandoned
-
2008
- 2008-10-09 US US12/248,514 patent/US7814919B2/en active Active
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5078149A (en) * | 1989-09-29 | 1992-01-07 | Terumo Kabushiki Kaisha | Ultrasonic coupler and method for production thereof |
US6463938B2 (en) * | 1996-09-30 | 2002-10-15 | Verteq, Inc. | Wafer cleaning method |
US6536452B1 (en) * | 1999-04-27 | 2003-03-25 | Tokyo Electron Limited | Processing apparatus and processing method |
US20040054288A1 (en) * | 2000-10-18 | 2004-03-18 | Nygaard Per Ehrenreich | Ultrasonic apparatus with rotatable probe, surrounded by a protective resilent sleeve |
US20030024547A1 (en) * | 2001-08-03 | 2003-02-06 | Bran Mario E. | Megasonic probe energy attenuator |
US6875696B2 (en) * | 2002-05-23 | 2005-04-05 | Kabushiki Kaisha Toshiba | Ultrasonic-wave washing unit, ultrasonic-wave washing apparatus, ultrasonic-wave washing method, method of manufacturing a semiconductor device, and method of manufacturing a liquid crystal display |
Also Published As
Publication number | Publication date |
---|---|
KR100777854B1 (en) | 2007-11-21 |
JP4519541B2 (en) | 2010-08-04 |
KR20060048481A (en) | 2006-05-18 |
TW200610593A (en) | 2006-04-01 |
US20050284509A1 (en) | 2005-12-29 |
CN1712144B (en) | 2010-05-26 |
US20090044844A1 (en) | 2009-02-19 |
TWI280161B (en) | 2007-05-01 |
CN1712144A (en) | 2005-12-28 |
JP2006007066A (en) | 2006-01-12 |
US7814919B2 (en) | 2010-10-19 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US7814919B2 (en) | Ultrasonic cleaning apparatus | |
US6039059A (en) | Wafer cleaning system | |
US6892738B2 (en) | Apparatus and methods for reducing damage to substrates during megasonic cleaning processes | |
US20130167881A1 (en) | Composite transducer apparatus and system for processing a substrate and method of constructing the same | |
US20040168706A1 (en) | Method and apparatus for megasonic cleaning with reflected acoustic waves | |
US9987666B2 (en) | Composite transducer apparatus and system for processing a substrate and method of constructing the same | |
US7105985B2 (en) | Megasonic transducer with focused energy resonator | |
JP2001046985A (en) | Ultrasonic exciting device for substrate end surface and ultrasonic washing device for substrate end surface provided with the same | |
JP2004039843A (en) | Apparatus and method for cleaning substrate | |
JPH11244795A (en) | Substrate washing apparatus | |
JP2010238744A (en) | Ultrasonic cleaning unit, and ultrasonic cleaning device | |
JP2003163195A (en) | Substrate treatment unit | |
JP3783174B2 (en) | Flowing water type ultrasonic cleaning equipment | |
JP2006095458A (en) | Single wafer processing cleaning method and single wafer processing cleaning apparatus | |
JPH1170372A (en) | Ultrasonic generating apparatus |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
STCB | Information on status: application discontinuation |
Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION |