US20100219168A1 - System and method for eliminating the structure and edge roughness produced during laser ablation of a material - Google Patents

System and method for eliminating the structure and edge roughness produced during laser ablation of a material Download PDF

Info

Publication number
US20100219168A1
US20100219168A1 US12/712,513 US71251310A US2010219168A1 US 20100219168 A1 US20100219168 A1 US 20100219168A1 US 71251310 A US71251310 A US 71251310A US 2010219168 A1 US2010219168 A1 US 2010219168A1
Authority
US
United States
Prior art keywords
ablation
laser
laser ablation
edge roughness
laser beam
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US12/712,513
Inventor
Alfred Wagner
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
GlobalFoundries Inc
Original Assignee
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Priority to US12/712,513 priority Critical patent/US20100219168A1/en
Publication of US20100219168A1 publication Critical patent/US20100219168A1/en
Assigned to GLOBALFOUNDRIES U.S. 2 LLC reassignment GLOBALFOUNDRIES U.S. 2 LLC ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: INTERNATIONAL BUSINESS MACHINES CORPORATION
Assigned to GLOBALFOUNDRIES INC. reassignment GLOBALFOUNDRIES INC. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: GLOBALFOUNDRIES U.S. 2 LLC, GLOBALFOUNDRIES U.S. INC.
Abandoned legal-status Critical Current

Links

Images

Classifications

    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B27/00Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
    • G02B27/28Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00 for polarising
    • G02B27/286Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00 for polarising for controlling or changing the state of polarisation, e.g. transforming one polarisation state into another
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06Shaping the laser beam, e.g. by masks or multi-focusing
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B23K26/0622Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
    • B23K26/0624Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses using ultrashort pulses, i.e. pulses of 1ns or less
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/0648Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising lenses
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/0665Shaping the laser beam, e.g. by masks or multi-focusing by beam condensation on the workpiece, e.g. for focusing
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/68Preparation processes not covered by groups G03F1/20 - G03F1/50
    • G03F1/72Repair or correction of mask defects
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00Materials to be soldered, welded or cut
    • B23K2103/50Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26

Definitions

  • the present invention relates generally to laser ablation, and more particularly pertains to a system and method for eliminating structure and edge roughness, which is produced during the laser ablation of a material.
  • an ultrashort pulsed laser beam is utilized to ablate undesired extra material, which is present in a photomask.
  • the pulsed laser beam is fired in a programmed spatial pattern, thereby removing the encountered extra material which causes a defect.
  • the process of laser ablation can produce a periodic structure in the irradiated material, whereby this periodic structure produces a significant roughness at the edge of the ablated defect, which degrades the optical quality of the repaired photomask. Consequently, there is a need to provide a system and method which will prevent or eliminate this edge roughness, and thereby to resultingly produce a repaired photomask with improved optical quality.
  • laser ablation can produce a periodic structure in the irradiated material, thereby resulting in a significant degree of roughness at the edge of the ablated defect, which degrades the optical quality of the repaired photomask.
  • This aspect is discussed in various publications, such as, for instance, the following articles: “Laser Induced Periodic Surface Structure: Experiments on Ge, Si, Al, and Brass”, Young, Preston, vsn Driel, and Sipe, Physical Review B, Vol. 27, No. 2, pgs. 1155-1172 (1983); “Ultraviolet Laser Induced Periodic Surface Structures”, Clark and Emmony, Physical Review B, Vol. 40, No.
  • Ablation of materials using a femtosecond laser beam produces a fine scale periodic structure in the ablated region.
  • the structure consists of residual (i.e. unablated material) and is always perpendicular to the polarization direction of the laser beam. By changing the polarization direction during the ablation process, the structure is averaged over many directions and thus eliminated.
  • Another object of the invention resides in imparting the method as described in an application to the repairing of photomasks so as to cause the optical quality thereof to be improved.
  • Yet another object is to provide a system of eliminating structure and edge roughness imparted to a material, such as a photomask, during laser ablation of the material.
  • FIG. 1 is an illustrative picture of a repaired photomask in which a defect was removed by femtosecond laser ablation;
  • FIG. 2 shows illustrative pictures of periodic structures in ablated lines as a function of the direction of polarization of the femtosecond laser beam
  • FIG. 3 is an illustrative block diagram of a system for rotating the polarization of a laser beam to average the direction of the ablation structure, and thereby eliminate it, according to one embodiment of the invention.
  • FIG. 4 is an illustrative picture of a line of ablated material in which the edge roughness (ablation structure) has been eliminated, according to one embodiment of the invention.
  • Defects are commonly encountered during the fabrication of a photomask, whereby these defects generally consist of extra (unwanted) material that must be removed in order to create a perfect photomask. Femtosecond lasers can be used to ablate this extra material, thus removing the defect.
  • the placement and spatial sharpness of the edge of the repaired region is critical to producing a high quality photomask. Anything that detracts from the placement and spatial sharpness of the repaired edge must be avoided.
  • FIG. 1 there is represented a picture of a repaired photomask 10 in which a defect was removed by femtosecond laser ablation of a repair site 12 .
  • Laser ablation typically produces a highly periodic structure 14 , which degrades the optical quality of the repaired edge 16 .
  • This periodic structure 14 can be traced to the polarization of the laser beam, which is used to ablate the material.
  • FIG. 2 there are illustrated images of periodic structures 20 , 22 , 24 , 26 , 28 and 30 formed in an ablated line as a function of the direction of polarization 32 , 34 and 36 of the femtosecond laser beam.
  • These periodic structures 20 , 22 , 24 , 26 , 28 and 30 are always oriented perpendicular to the polarization directions 32 , 34 and 36 of the laser beam. If multiple polarization directions are used during the ablation sequence, the resulting structure consists of an average over these directions of the periodic structure formed by any individual polarization direction. Thus, by performing the ablation using a series of polarization directions, the periodic structure is minimized or eliminated by means of averaging.
  • FIG. 3 there is shown a block diagram of a system for rotating the polarization of a laser beam to average the direction of the ablation structure, and thereby eliminated.
  • the system includes a 1 ⁇ 4 waveplate 40 , a focusing lens 42 , and a photomask 44 .
  • Linearly polarized light 46 which is pulsed from a femtolaser 48 passes through the 1 ⁇ 4 waveplate 40 and is turned into circularly (or eliptically) polarized light 50 .
  • the circularly polarized light 50 passes through the focusing lens 42 and is incident on the photomask 44 .
  • the polarization direction of the incident laser light would continuously change direction during each laser pulse.
  • 266 nm laser pulses which are employed for mask repair, the polarization direction would rotate a full 360 degrees through approximately one hundred times, thus averaging the periodic structure over all directions many times.
  • the effective number of polarization direction cycles will be considerably less than one hundred.
  • the effective polarization direction would be nearly identical for each laser if the amplitude of each laser pulse was nearly identical. This is undesirable since it reduces the amount of averaging over each polarization direction. Therefore, it is also advantageous if there is some pulse to pulse variation in the amplitude of laser pulses, and if multiple laser pulses overlap spatially. This variation will help to randomize the polarization directions from one laser pulse to the next.
  • FIG. 4 there is illustrated an image of a line of ablated material 60 in which the edge roughness (ablation structure) has been eliminated.
  • a quarter wave plate was inserted into the laser path just prior to the laser beam entering the final focusing lens.
  • the resulting ablation does not evidence any of periodic structure, and thus the edges of the ablated region are very smooth.
  • An alternative method of averaging over many polarization directions involves a rotating half wave plate.
  • the polarization direction By mechanically rotating a half wave plate during an ablation, the polarization direction also rotates, thus averaging the periodic ablation structure.
  • the repaired region could be scanned repeatedly with the half wave plate rotated by 90 degrees between each scan. This would produce an average of two periodic structures oriented at 90 degrees to each other.
  • Another method of averaging over many polarization directions involves inserting a Pockell Cell in the path of the laser beam. By applying a voltage to the Pockell Cell, the polarization direction can be rotated to any desired angle. If the applied voltage is varied as the laser beam is scanned, averaging over any desired number of polarization directions can be achieved.

Abstract

The present technology relates generally to laser ablation, and more particularly pertains to a system and method for eliminating structure and edge roughness, which is produced during the laser ablation of a material. Ablation of materials using a femtosecond laser beam produces a fine scale periodic structure in the ablated region. The structure consists of residual (i.e. unablated material) and is always perpendicular to the polarization direction of the laser beam. By changing the polarization direction during the ablation process, the structure is averaged over many directions and thus eliminated. This eliminates structure and edge roughness in a material caused by the laser ablation of the material. The method is employed to the repairing of photomasks so as to cause the optical quality thereof to be improved.

Description

    CROSS-REFERENCE TO RELATED APPLICATIONS
  • This application is a divisional application of U.S. Ser. No. 11/624,257, filed Jan. 18, 2007.
  • BACKGROUND OF THE INVENTION
  • 1. Field of the Invention
  • The present invention relates generally to laser ablation, and more particularly pertains to a system and method for eliminating structure and edge roughness, which is produced during the laser ablation of a material.
  • Typically, in this particular technology, an ultrashort pulsed laser beam is utilized to ablate undesired extra material, which is present in a photomask. The pulsed laser beam is fired in a programmed spatial pattern, thereby removing the encountered extra material which causes a defect. However, it is possible that the process of laser ablation can produce a periodic structure in the irradiated material, whereby this periodic structure produces a significant roughness at the edge of the ablated defect, which degrades the optical quality of the repaired photomask. Consequently, there is a need to provide a system and method which will prevent or eliminate this edge roughness, and thereby to resultingly produce a repaired photomask with improved optical quality.
  • 2. Discussion of the Prior Art
  • In the current state-of-the-technology, a number of publications are known which disclose and teach the application of equipment and methods, which are required in order to remove defects encountered in lithographic masks. To that effect, an ulstrashort pulsed laser beam may be utilized to ablate undesired extra material in a programmed spatial pattern, thereby removing the encountered defects. The foregoing aspects are disclosed in Grenon, et al., U.S. Pat. Nos. 6,190,836; 6,165,649; 6,156,461; 6,090,507; and Haight, et al., U.S. Pat. No. 6,333,485.
  • Furthermore, as known, laser ablation can produce a periodic structure in the irradiated material, thereby resulting in a significant degree of roughness at the edge of the ablated defect, which degrades the optical quality of the repaired photomask. This aspect is discussed in various publications, such as, for instance, the following articles: “Laser Induced Periodic Surface Structure: Experiments on Ge, Si, Al, and Brass”, Young, Preston, vsn Driel, and Sipe, Physical Review B, Vol. 27, No. 2, pgs. 1155-1172 (1983); “Ultraviolet Laser Induced Periodic Surface Structures”, Clark and Emmony, Physical Review B, Vol. 40, No. 4, pgs 2031-2041 (1989); “Femtosecond Laser Induced Periodic Surface Structure on Diamond Film”, Wu, Ma, Fang, Liao, Yu, Chen, Wang, Applied Physics Letters, Vol. 82, No. 11, pgs 1703-1705 (2003); and “Self Organixed Nanogratings in Glass Irradiated by Ultrashort Light Pulses”, Shimotsuma, Kazansky, Qui, Hirao, Physical Review Letters, Vol. 19, No. 24, pgs 247205-1 to 4 (2003).
  • SUMMARY OF THE INVENTION
  • Ablation of materials using a femtosecond laser beam produces a fine scale periodic structure in the ablated region. The structure consists of residual (i.e. unablated material) and is always perpendicular to the polarization direction of the laser beam. By changing the polarization direction during the ablation process, the structure is averaged over many directions and thus eliminated.
  • Accordingly, it is an object of the present invention to provide a method of eliminating structure and edge roughness in a material caused by the laser ablation of the material.
  • Another object of the invention resides in imparting the method as described in an application to the repairing of photomasks so as to cause the optical quality thereof to be improved.
  • Yet another object is to provide a system of eliminating structure and edge roughness imparted to a material, such as a photomask, during laser ablation of the material.
  • The foregoing and other objects, aspects, features, and advantages of the invention will become more readily apparent from the following description and from the claims.
  • BRIEF DESCRIPTION OF THE DRAWINGS
  • In the drawings, like reference characters generally refer to the same parts throughout the different views. Also, the drawings are not necessarily to scale, emphasis instead generally being placed upon illustrating the principles of the invention; wherein:
  • FIG. 1 is an illustrative picture of a repaired photomask in which a defect was removed by femtosecond laser ablation;
  • FIG. 2 shows illustrative pictures of periodic structures in ablated lines as a function of the direction of polarization of the femtosecond laser beam;
  • FIG. 3 is an illustrative block diagram of a system for rotating the polarization of a laser beam to average the direction of the ablation structure, and thereby eliminate it, according to one embodiment of the invention; and
  • FIG. 4 is an illustrative picture of a line of ablated material in which the edge roughness (ablation structure) has been eliminated, according to one embodiment of the invention.
  • DETAILED DESCRIPTION OF THE INVENTION
  • Defects are commonly encountered during the fabrication of a photomask, whereby these defects generally consist of extra (unwanted) material that must be removed in order to create a perfect photomask. Femtosecond lasers can be used to ablate this extra material, thus removing the defect. Hereby, the placement and spatial sharpness of the edge of the repaired region is critical to producing a high quality photomask. Anything that detracts from the placement and spatial sharpness of the repaired edge must be avoided.
  • Referring to FIG. 1, there is represented a picture of a repaired photomask 10 in which a defect was removed by femtosecond laser ablation of a repair site 12. Laser ablation typically produces a highly periodic structure 14, which degrades the optical quality of the repaired edge 16. This periodic structure 14 can be traced to the polarization of the laser beam, which is used to ablate the material.
  • Referring to FIG. 2, there are illustrated images of periodic structures 20, 22, 24, 26, 28 and 30 formed in an ablated line as a function of the direction of polarization 32, 34 and 36 of the femtosecond laser beam. These periodic structures 20, 22, 24, 26, 28 and 30 are always oriented perpendicular to the polarization directions 32, 34 and 36 of the laser beam. If multiple polarization directions are used during the ablation sequence, the resulting structure consists of an average over these directions of the periodic structure formed by any individual polarization direction. Thus, by performing the ablation using a series of polarization directions, the periodic structure is minimized or eliminated by means of averaging.
  • Referring to FIG. 3, there is shown a block diagram of a system for rotating the polarization of a laser beam to average the direction of the ablation structure, and thereby eliminated. The system includes a ¼ waveplate 40, a focusing lens 42, and a photomask 44. Linearly polarized light 46, which is pulsed from a femtolaser 48 passes through the ¼ waveplate 40 and is turned into circularly (or eliptically) polarized light 50. The circularly polarized light 50 passes through the focusing lens 42 and is incident on the photomask 44. In this case, the polarization direction of the incident laser light would continuously change direction during each laser pulse. By way of example, for 100 femtosecond, 266 nm laser pulses, which are employed for mask repair, the polarization direction would rotate a full 360 degrees through approximately one hundred times, thus averaging the periodic structure over all directions many times.
  • Since ablation occurs only over the portion of each laser pulse in which the laser amplitude exceeds the threshold for ablation, the effective number of polarization direction cycles will be considerably less than one hundred. At the limit which only the peak of the laser pulse ablates material (a situation which results in the highest spatial resolution), the effective polarization direction would be nearly identical for each laser if the amplitude of each laser pulse was nearly identical. This is undesirable since it reduces the amount of averaging over each polarization direction. Therefore, it is also advantageous if there is some pulse to pulse variation in the amplitude of laser pulses, and if multiple laser pulses overlap spatially. This variation will help to randomize the polarization directions from one laser pulse to the next.
  • Referring to FIG. 4, there is illustrated an image of a line of ablated material 60 in which the edge roughness (ablation structure) has been eliminated. In this case, a quarter wave plate was inserted into the laser path just prior to the laser beam entering the final focusing lens. There was approximately a 5% pulse to pulse variation in the amplitude of each laser pulse. The resulting ablation does not evidence any of periodic structure, and thus the edges of the ablated region are very smooth.
  • An alternative method of averaging over many polarization directions involves a rotating half wave plate. By mechanically rotating a half wave plate during an ablation, the polarization direction also rotates, thus averaging the periodic ablation structure. For example, the repaired region could be scanned repeatedly with the half wave plate rotated by 90 degrees between each scan. This would produce an average of two periodic structures oriented at 90 degrees to each other.
  • Another method of averaging over many polarization directions involves inserting a Pockell Cell in the path of the laser beam. By applying a voltage to the Pockell Cell, the polarization direction can be rotated to any desired angle. If the applied voltage is varied as the laser beam is scanned, averaging over any desired number of polarization directions can be achieved.
  • Variations, modifications, and other implementations of what is described herein may occur to those of ordinary skill in the art without departing from the spirit and scope of the invention. Accordingly, the invention is not to be defined only by the preceding illustrative description.

Claims (4)

1. A system of reducing periodic structures formed in a photomask material during a laser ablation process, the method system:
a laser for producing incident linearly polarized laser light;
means for converting the incident linearly polarized laser light to circularly or eliptically polarized laser light; and
means for averaging a plurality of polarization directions during the laser ablation process.
2. The system as claimed in claim 1, wherein the means for polarizing and averaging comprise a quarter wave plate inserted into an optical path of the linearly polarized laser light to produce said circularly or eliptically polarized light.
3. The system as claimed in claim 1, wherein the means for polarizing comprises a half wave plate inserted into an optical path of the linearly polarized laser light to alter the direction of polarization.
4. The system as claimed in claim 1, wherein the means for averaging comprises means for rotating the half wave plate during the laser ablation process.
US12/712,513 2007-01-18 2010-02-25 System and method for eliminating the structure and edge roughness produced during laser ablation of a material Abandoned US20100219168A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US12/712,513 US20100219168A1 (en) 2007-01-18 2010-02-25 System and method for eliminating the structure and edge roughness produced during laser ablation of a material

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US11/624,257 US7732104B2 (en) 2007-01-18 2007-01-18 System and method for eliminating the structure and edge roughness produced during laser ablation of a material
US12/712,513 US20100219168A1 (en) 2007-01-18 2010-02-25 System and method for eliminating the structure and edge roughness produced during laser ablation of a material

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
US11/624,257 Division US7732104B2 (en) 2007-01-18 2007-01-18 System and method for eliminating the structure and edge roughness produced during laser ablation of a material

Publications (1)

Publication Number Publication Date
US20100219168A1 true US20100219168A1 (en) 2010-09-02

Family

ID=39641586

Family Applications (2)

Application Number Title Priority Date Filing Date
US11/624,257 Expired - Fee Related US7732104B2 (en) 2007-01-18 2007-01-18 System and method for eliminating the structure and edge roughness produced during laser ablation of a material
US12/712,513 Abandoned US20100219168A1 (en) 2007-01-18 2010-02-25 System and method for eliminating the structure and edge roughness produced during laser ablation of a material

Family Applications Before (1)

Application Number Title Priority Date Filing Date
US11/624,257 Expired - Fee Related US7732104B2 (en) 2007-01-18 2007-01-18 System and method for eliminating the structure and edge roughness produced during laser ablation of a material

Country Status (1)

Country Link
US (2) US7732104B2 (en)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7875414B2 (en) * 2002-09-27 2011-01-25 Canon Machinery Inc. Cyclic structure formation method and surface treatment method
US8263899B2 (en) 2010-07-01 2012-09-11 Sunpower Corporation High throughput solar cell ablation system
US8586403B2 (en) 2011-02-15 2013-11-19 Sunpower Corporation Process and structures for fabrication of solar cells with laser ablation steps to form contact holes
US8692111B2 (en) 2011-08-23 2014-04-08 Sunpower Corporation High throughput laser ablation processes and structures for forming contact holes in solar cells
US8822262B2 (en) 2011-12-22 2014-09-02 Sunpower Corporation Fabricating solar cells with silicon nanoparticles
US8513045B1 (en) 2012-01-31 2013-08-20 Sunpower Corporation Laser system with multiple laser pulses for fabrication of solar cells
US9632407B2 (en) * 2014-07-18 2017-04-25 Kabushiki Kaisha Yoshiba Mask processing apparatus and mask processing method
US20190151993A1 (en) * 2017-11-22 2019-05-23 Asm Technology Singapore Pte Ltd Laser-cutting using selective polarization
CN109014566B (en) * 2018-10-16 2021-04-06 北京理工大学 Method for simply controlling arrangement direction of laser-induced surface periodic structure
CN110899957B (en) * 2019-11-27 2021-01-15 西安交通大学 Method for realizing information display and encryption based on femtosecond laser induced segmentation pattern

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5057664A (en) * 1989-10-20 1991-10-15 Electro Scientific Industries, Inc. Method and apparatus for laser processing a target material to provide a uniformly smooth, continuous trim profile
US6090507A (en) * 1997-01-21 2000-07-18 International Business Machines Corporation Methods for repair of photomasks
US6120725A (en) * 1997-07-25 2000-09-19 Matsushita Electric Works, Ltd. Method of forming a complex profile of uneven depressions in the surface of a workpiece by energy beam ablation
US6333485B1 (en) * 1998-12-11 2001-12-25 International Business Machines Corporation Method for minimizing sample damage during the ablation of material using a focused ultrashort pulsed beam
US20030226830A1 (en) * 2002-06-10 2003-12-11 New Wave Research Scribing sapphire substrates with a solid state UV laser
US20050205538A1 (en) * 2004-03-22 2005-09-22 Ming Li Method of controlling hole shape during ultrafast laser machining by manipulating beam polarization
US6951627B2 (en) * 2002-04-26 2005-10-04 Matsushita Electric Industrial Co., Ltd. Method of drilling holes with precision laser micromachining

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5057664A (en) * 1989-10-20 1991-10-15 Electro Scientific Industries, Inc. Method and apparatus for laser processing a target material to provide a uniformly smooth, continuous trim profile
US6090507A (en) * 1997-01-21 2000-07-18 International Business Machines Corporation Methods for repair of photomasks
US6156461A (en) * 1997-01-21 2000-12-05 International Business Machines Corporation Method for repair of photomasks
US6165649A (en) * 1997-01-21 2000-12-26 International Business Machines Corporation Methods for repair of photomasks
US6190836B1 (en) * 1997-01-21 2001-02-20 International Business Machines Corporation Methods for repair of photomasks
US6120725A (en) * 1997-07-25 2000-09-19 Matsushita Electric Works, Ltd. Method of forming a complex profile of uneven depressions in the surface of a workpiece by energy beam ablation
US6333485B1 (en) * 1998-12-11 2001-12-25 International Business Machines Corporation Method for minimizing sample damage during the ablation of material using a focused ultrashort pulsed beam
US6951627B2 (en) * 2002-04-26 2005-10-04 Matsushita Electric Industrial Co., Ltd. Method of drilling holes with precision laser micromachining
US20030226830A1 (en) * 2002-06-10 2003-12-11 New Wave Research Scribing sapphire substrates with a solid state UV laser
US20050205538A1 (en) * 2004-03-22 2005-09-22 Ming Li Method of controlling hole shape during ultrafast laser machining by manipulating beam polarization

Also Published As

Publication number Publication date
US20080176147A1 (en) 2008-07-24
US7732104B2 (en) 2010-06-08

Similar Documents

Publication Publication Date Title
US7732104B2 (en) System and method for eliminating the structure and edge roughness produced during laser ablation of a material
US8344286B2 (en) Enhanced quality of laser ablation by controlling laser repetition rate
KR101500021B1 (en) laser ablation using multiple wavelengths
US7646538B2 (en) Methods and apparatus for creating apertures through microlens arrays using curved cradles
JP2799080B2 (en) Laser processing method and apparatus, transmission type liquid crystal element, wiring pattern defect correcting method and apparatus
JP6049043B2 (en) Apparatus and method for compensating for channel defects in a microlithographic projection exposure system
US6518539B2 (en) Method for producing damage resistant optics
JP2008264854A (en) Laser beam irradiation apparatus and laser beam irradiation method
US9606444B2 (en) Method and apparatus for locally deforming an optical element for photolithography
JP3042155B2 (en) Photomask repair apparatus and photomask repair method
DE102015217523B4 (en) Process for locally defined processing on the surfaces of workpieces using laser light
JP2013066899A (en) Laser machining apparatus
JP5157110B2 (en) Cylindrical member manufacturing method, transcript using the same, and cylindrical member knob defect correcting device
KR102375960B1 (en) Laser Repair Apparatus with Controllable Beam Profile
KR100717885B1 (en) Wide Marking device of a laser foundation
US20170334020A1 (en) Apparatus and method for multi-beam direct engraving of elastomeric printing plates and sleeves
JPH08172063A (en) Laser repairing device
JP2000155409A (en) Method for correcting photomask
JP2010102063A (en) Correction method for color-filter substrate, and color filter
WO2023219213A1 (en) Method for forming precise through-hole at high speed by using infrared laser
KR20060030870A (en) Edge exposure device of a laser foundation
KR200422344Y1 (en) Wide Marking device of a laser foundation
US20080280454A1 (en) Wafer recycling method using laser films stripping
JPS6184833A (en) Inspection-correction apparatus for mask pattern defect
TW490737B (en) Positioning method for mask defects

Legal Events

Date Code Title Description
STCB Information on status: application discontinuation

Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION

AS Assignment

Owner name: GLOBALFOUNDRIES U.S. 2 LLC, NEW YORK

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:INTERNATIONAL BUSINESS MACHINES CORPORATION;REEL/FRAME:036550/0001

Effective date: 20150629

AS Assignment

Owner name: GLOBALFOUNDRIES INC., CAYMAN ISLANDS

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:GLOBALFOUNDRIES U.S. 2 LLC;GLOBALFOUNDRIES U.S. INC.;REEL/FRAME:036779/0001

Effective date: 20150910