US20100219168A1 - System and method for eliminating the structure and edge roughness produced during laser ablation of a material - Google Patents
System and method for eliminating the structure and edge roughness produced during laser ablation of a material Download PDFInfo
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- US20100219168A1 US20100219168A1 US12/712,513 US71251310A US2010219168A1 US 20100219168 A1 US20100219168 A1 US 20100219168A1 US 71251310 A US71251310 A US 71251310A US 2010219168 A1 US2010219168 A1 US 2010219168A1
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- Prior art keywords
- ablation
- laser
- laser ablation
- edge roughness
- laser beam
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- 239000000463 material Substances 0.000 title claims abstract description 25
- 238000000034 method Methods 0.000 title claims abstract description 17
- 238000000608 laser ablation Methods 0.000 title claims abstract description 16
- 230000010287 polarization Effects 0.000 claims abstract description 26
- 230000000737 periodic effect Effects 0.000 claims abstract description 20
- 230000003287 optical effect Effects 0.000 claims abstract description 8
- 230000008569 process Effects 0.000 claims abstract description 6
- 238000012935 Averaging Methods 0.000 claims description 10
- 238000002679 ablation Methods 0.000 abstract description 15
- 230000007547 defect Effects 0.000 description 10
- 238000012552 review Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 230000008439 repair process Effects 0.000 description 2
- 229910001369 Brass Inorganic materials 0.000 description 1
- 239000010951 brass Substances 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
- G02B27/28—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00 for polarising
- G02B27/286—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00 for polarising for controlling or changing the state of polarisation, e.g. transforming one polarisation state into another
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
- B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
- B23K26/0624—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses using ultrashort pulses, i.e. pulses of 1ns or less
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
- B23K26/0648—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising lenses
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/0665—Shaping the laser beam, e.g. by masks or multi-focusing by beam condensation on the workpiece, e.g. for focusing
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/68—Preparation processes not covered by groups G03F1/20 - G03F1/50
- G03F1/72—Repair or correction of mask defects
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
Definitions
- the present invention relates generally to laser ablation, and more particularly pertains to a system and method for eliminating structure and edge roughness, which is produced during the laser ablation of a material.
- an ultrashort pulsed laser beam is utilized to ablate undesired extra material, which is present in a photomask.
- the pulsed laser beam is fired in a programmed spatial pattern, thereby removing the encountered extra material which causes a defect.
- the process of laser ablation can produce a periodic structure in the irradiated material, whereby this periodic structure produces a significant roughness at the edge of the ablated defect, which degrades the optical quality of the repaired photomask. Consequently, there is a need to provide a system and method which will prevent or eliminate this edge roughness, and thereby to resultingly produce a repaired photomask with improved optical quality.
- laser ablation can produce a periodic structure in the irradiated material, thereby resulting in a significant degree of roughness at the edge of the ablated defect, which degrades the optical quality of the repaired photomask.
- This aspect is discussed in various publications, such as, for instance, the following articles: “Laser Induced Periodic Surface Structure: Experiments on Ge, Si, Al, and Brass”, Young, Preston, vsn Driel, and Sipe, Physical Review B, Vol. 27, No. 2, pgs. 1155-1172 (1983); “Ultraviolet Laser Induced Periodic Surface Structures”, Clark and Emmony, Physical Review B, Vol. 40, No.
- Ablation of materials using a femtosecond laser beam produces a fine scale periodic structure in the ablated region.
- the structure consists of residual (i.e. unablated material) and is always perpendicular to the polarization direction of the laser beam. By changing the polarization direction during the ablation process, the structure is averaged over many directions and thus eliminated.
- Another object of the invention resides in imparting the method as described in an application to the repairing of photomasks so as to cause the optical quality thereof to be improved.
- Yet another object is to provide a system of eliminating structure and edge roughness imparted to a material, such as a photomask, during laser ablation of the material.
- FIG. 1 is an illustrative picture of a repaired photomask in which a defect was removed by femtosecond laser ablation;
- FIG. 2 shows illustrative pictures of periodic structures in ablated lines as a function of the direction of polarization of the femtosecond laser beam
- FIG. 3 is an illustrative block diagram of a system for rotating the polarization of a laser beam to average the direction of the ablation structure, and thereby eliminate it, according to one embodiment of the invention.
- FIG. 4 is an illustrative picture of a line of ablated material in which the edge roughness (ablation structure) has been eliminated, according to one embodiment of the invention.
- Defects are commonly encountered during the fabrication of a photomask, whereby these defects generally consist of extra (unwanted) material that must be removed in order to create a perfect photomask. Femtosecond lasers can be used to ablate this extra material, thus removing the defect.
- the placement and spatial sharpness of the edge of the repaired region is critical to producing a high quality photomask. Anything that detracts from the placement and spatial sharpness of the repaired edge must be avoided.
- FIG. 1 there is represented a picture of a repaired photomask 10 in which a defect was removed by femtosecond laser ablation of a repair site 12 .
- Laser ablation typically produces a highly periodic structure 14 , which degrades the optical quality of the repaired edge 16 .
- This periodic structure 14 can be traced to the polarization of the laser beam, which is used to ablate the material.
- FIG. 2 there are illustrated images of periodic structures 20 , 22 , 24 , 26 , 28 and 30 formed in an ablated line as a function of the direction of polarization 32 , 34 and 36 of the femtosecond laser beam.
- These periodic structures 20 , 22 , 24 , 26 , 28 and 30 are always oriented perpendicular to the polarization directions 32 , 34 and 36 of the laser beam. If multiple polarization directions are used during the ablation sequence, the resulting structure consists of an average over these directions of the periodic structure formed by any individual polarization direction. Thus, by performing the ablation using a series of polarization directions, the periodic structure is minimized or eliminated by means of averaging.
- FIG. 3 there is shown a block diagram of a system for rotating the polarization of a laser beam to average the direction of the ablation structure, and thereby eliminated.
- the system includes a 1 ⁇ 4 waveplate 40 , a focusing lens 42 , and a photomask 44 .
- Linearly polarized light 46 which is pulsed from a femtolaser 48 passes through the 1 ⁇ 4 waveplate 40 and is turned into circularly (or eliptically) polarized light 50 .
- the circularly polarized light 50 passes through the focusing lens 42 and is incident on the photomask 44 .
- the polarization direction of the incident laser light would continuously change direction during each laser pulse.
- 266 nm laser pulses which are employed for mask repair, the polarization direction would rotate a full 360 degrees through approximately one hundred times, thus averaging the periodic structure over all directions many times.
- the effective number of polarization direction cycles will be considerably less than one hundred.
- the effective polarization direction would be nearly identical for each laser if the amplitude of each laser pulse was nearly identical. This is undesirable since it reduces the amount of averaging over each polarization direction. Therefore, it is also advantageous if there is some pulse to pulse variation in the amplitude of laser pulses, and if multiple laser pulses overlap spatially. This variation will help to randomize the polarization directions from one laser pulse to the next.
- FIG. 4 there is illustrated an image of a line of ablated material 60 in which the edge roughness (ablation structure) has been eliminated.
- a quarter wave plate was inserted into the laser path just prior to the laser beam entering the final focusing lens.
- the resulting ablation does not evidence any of periodic structure, and thus the edges of the ablated region are very smooth.
- An alternative method of averaging over many polarization directions involves a rotating half wave plate.
- the polarization direction By mechanically rotating a half wave plate during an ablation, the polarization direction also rotates, thus averaging the periodic ablation structure.
- the repaired region could be scanned repeatedly with the half wave plate rotated by 90 degrees between each scan. This would produce an average of two periodic structures oriented at 90 degrees to each other.
- Another method of averaging over many polarization directions involves inserting a Pockell Cell in the path of the laser beam. By applying a voltage to the Pockell Cell, the polarization direction can be rotated to any desired angle. If the applied voltage is varied as the laser beam is scanned, averaging over any desired number of polarization directions can be achieved.
Abstract
Description
- This application is a divisional application of U.S. Ser. No. 11/624,257, filed Jan. 18, 2007.
- 1. Field of the Invention
- The present invention relates generally to laser ablation, and more particularly pertains to a system and method for eliminating structure and edge roughness, which is produced during the laser ablation of a material.
- Typically, in this particular technology, an ultrashort pulsed laser beam is utilized to ablate undesired extra material, which is present in a photomask. The pulsed laser beam is fired in a programmed spatial pattern, thereby removing the encountered extra material which causes a defect. However, it is possible that the process of laser ablation can produce a periodic structure in the irradiated material, whereby this periodic structure produces a significant roughness at the edge of the ablated defect, which degrades the optical quality of the repaired photomask. Consequently, there is a need to provide a system and method which will prevent or eliminate this edge roughness, and thereby to resultingly produce a repaired photomask with improved optical quality.
- 2. Discussion of the Prior Art
- In the current state-of-the-technology, a number of publications are known which disclose and teach the application of equipment and methods, which are required in order to remove defects encountered in lithographic masks. To that effect, an ulstrashort pulsed laser beam may be utilized to ablate undesired extra material in a programmed spatial pattern, thereby removing the encountered defects. The foregoing aspects are disclosed in Grenon, et al., U.S. Pat. Nos. 6,190,836; 6,165,649; 6,156,461; 6,090,507; and Haight, et al., U.S. Pat. No. 6,333,485.
- Furthermore, as known, laser ablation can produce a periodic structure in the irradiated material, thereby resulting in a significant degree of roughness at the edge of the ablated defect, which degrades the optical quality of the repaired photomask. This aspect is discussed in various publications, such as, for instance, the following articles: “Laser Induced Periodic Surface Structure: Experiments on Ge, Si, Al, and Brass”, Young, Preston, vsn Driel, and Sipe, Physical Review B, Vol. 27, No. 2, pgs. 1155-1172 (1983); “Ultraviolet Laser Induced Periodic Surface Structures”, Clark and Emmony, Physical Review B, Vol. 40, No. 4, pgs 2031-2041 (1989); “Femtosecond Laser Induced Periodic Surface Structure on Diamond Film”, Wu, Ma, Fang, Liao, Yu, Chen, Wang, Applied Physics Letters, Vol. 82, No. 11, pgs 1703-1705 (2003); and “Self Organixed Nanogratings in Glass Irradiated by Ultrashort Light Pulses”, Shimotsuma, Kazansky, Qui, Hirao, Physical Review Letters, Vol. 19, No. 24, pgs 247205-1 to 4 (2003).
- Ablation of materials using a femtosecond laser beam produces a fine scale periodic structure in the ablated region. The structure consists of residual (i.e. unablated material) and is always perpendicular to the polarization direction of the laser beam. By changing the polarization direction during the ablation process, the structure is averaged over many directions and thus eliminated.
- Accordingly, it is an object of the present invention to provide a method of eliminating structure and edge roughness in a material caused by the laser ablation of the material.
- Another object of the invention resides in imparting the method as described in an application to the repairing of photomasks so as to cause the optical quality thereof to be improved.
- Yet another object is to provide a system of eliminating structure and edge roughness imparted to a material, such as a photomask, during laser ablation of the material.
- The foregoing and other objects, aspects, features, and advantages of the invention will become more readily apparent from the following description and from the claims.
- In the drawings, like reference characters generally refer to the same parts throughout the different views. Also, the drawings are not necessarily to scale, emphasis instead generally being placed upon illustrating the principles of the invention; wherein:
-
FIG. 1 is an illustrative picture of a repaired photomask in which a defect was removed by femtosecond laser ablation; -
FIG. 2 shows illustrative pictures of periodic structures in ablated lines as a function of the direction of polarization of the femtosecond laser beam; -
FIG. 3 is an illustrative block diagram of a system for rotating the polarization of a laser beam to average the direction of the ablation structure, and thereby eliminate it, according to one embodiment of the invention; and -
FIG. 4 is an illustrative picture of a line of ablated material in which the edge roughness (ablation structure) has been eliminated, according to one embodiment of the invention. - Defects are commonly encountered during the fabrication of a photomask, whereby these defects generally consist of extra (unwanted) material that must be removed in order to create a perfect photomask. Femtosecond lasers can be used to ablate this extra material, thus removing the defect. Hereby, the placement and spatial sharpness of the edge of the repaired region is critical to producing a high quality photomask. Anything that detracts from the placement and spatial sharpness of the repaired edge must be avoided.
- Referring to
FIG. 1 , there is represented a picture of a repairedphotomask 10 in which a defect was removed by femtosecond laser ablation of arepair site 12. Laser ablation typically produces a highlyperiodic structure 14, which degrades the optical quality of the repaired edge 16. Thisperiodic structure 14 can be traced to the polarization of the laser beam, which is used to ablate the material. - Referring to
FIG. 2 , there are illustrated images ofperiodic structures polarization periodic structures polarization directions - Referring to
FIG. 3 , there is shown a block diagram of a system for rotating the polarization of a laser beam to average the direction of the ablation structure, and thereby eliminated. The system includes a ¼waveplate 40, a focusinglens 42, and aphotomask 44. Linearly polarizedlight 46, which is pulsed from afemtolaser 48 passes through the ¼waveplate 40 and is turned into circularly (or eliptically) polarizedlight 50. The circularly polarizedlight 50 passes through the focusinglens 42 and is incident on thephotomask 44. In this case, the polarization direction of the incident laser light would continuously change direction during each laser pulse. By way of example, for 100 femtosecond, 266 nm laser pulses, which are employed for mask repair, the polarization direction would rotate a full 360 degrees through approximately one hundred times, thus averaging the periodic structure over all directions many times. - Since ablation occurs only over the portion of each laser pulse in which the laser amplitude exceeds the threshold for ablation, the effective number of polarization direction cycles will be considerably less than one hundred. At the limit which only the peak of the laser pulse ablates material (a situation which results in the highest spatial resolution), the effective polarization direction would be nearly identical for each laser if the amplitude of each laser pulse was nearly identical. This is undesirable since it reduces the amount of averaging over each polarization direction. Therefore, it is also advantageous if there is some pulse to pulse variation in the amplitude of laser pulses, and if multiple laser pulses overlap spatially. This variation will help to randomize the polarization directions from one laser pulse to the next.
- Referring to
FIG. 4 , there is illustrated an image of a line of ablatedmaterial 60 in which the edge roughness (ablation structure) has been eliminated. In this case, a quarter wave plate was inserted into the laser path just prior to the laser beam entering the final focusing lens. There was approximately a 5% pulse to pulse variation in the amplitude of each laser pulse. The resulting ablation does not evidence any of periodic structure, and thus the edges of the ablated region are very smooth. - An alternative method of averaging over many polarization directions involves a rotating half wave plate. By mechanically rotating a half wave plate during an ablation, the polarization direction also rotates, thus averaging the periodic ablation structure. For example, the repaired region could be scanned repeatedly with the half wave plate rotated by 90 degrees between each scan. This would produce an average of two periodic structures oriented at 90 degrees to each other.
- Another method of averaging over many polarization directions involves inserting a Pockell Cell in the path of the laser beam. By applying a voltage to the Pockell Cell, the polarization direction can be rotated to any desired angle. If the applied voltage is varied as the laser beam is scanned, averaging over any desired number of polarization directions can be achieved.
- Variations, modifications, and other implementations of what is described herein may occur to those of ordinary skill in the art without departing from the spirit and scope of the invention. Accordingly, the invention is not to be defined only by the preceding illustrative description.
Claims (4)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US12/712,513 US20100219168A1 (en) | 2007-01-18 | 2010-02-25 | System and method for eliminating the structure and edge roughness produced during laser ablation of a material |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US11/624,257 US7732104B2 (en) | 2007-01-18 | 2007-01-18 | System and method for eliminating the structure and edge roughness produced during laser ablation of a material |
US12/712,513 US20100219168A1 (en) | 2007-01-18 | 2010-02-25 | System and method for eliminating the structure and edge roughness produced during laser ablation of a material |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
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US11/624,257 Division US7732104B2 (en) | 2007-01-18 | 2007-01-18 | System and method for eliminating the structure and edge roughness produced during laser ablation of a material |
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US20100219168A1 true US20100219168A1 (en) | 2010-09-02 |
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US11/624,257 Expired - Fee Related US7732104B2 (en) | 2007-01-18 | 2007-01-18 | System and method for eliminating the structure and edge roughness produced during laser ablation of a material |
US12/712,513 Abandoned US20100219168A1 (en) | 2007-01-18 | 2010-02-25 | System and method for eliminating the structure and edge roughness produced during laser ablation of a material |
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US11/624,257 Expired - Fee Related US7732104B2 (en) | 2007-01-18 | 2007-01-18 | System and method for eliminating the structure and edge roughness produced during laser ablation of a material |
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Families Citing this family (10)
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US7875414B2 (en) * | 2002-09-27 | 2011-01-25 | Canon Machinery Inc. | Cyclic structure formation method and surface treatment method |
US8263899B2 (en) | 2010-07-01 | 2012-09-11 | Sunpower Corporation | High throughput solar cell ablation system |
US8586403B2 (en) | 2011-02-15 | 2013-11-19 | Sunpower Corporation | Process and structures for fabrication of solar cells with laser ablation steps to form contact holes |
US8692111B2 (en) | 2011-08-23 | 2014-04-08 | Sunpower Corporation | High throughput laser ablation processes and structures for forming contact holes in solar cells |
US8822262B2 (en) | 2011-12-22 | 2014-09-02 | Sunpower Corporation | Fabricating solar cells with silicon nanoparticles |
US8513045B1 (en) | 2012-01-31 | 2013-08-20 | Sunpower Corporation | Laser system with multiple laser pulses for fabrication of solar cells |
US9632407B2 (en) * | 2014-07-18 | 2017-04-25 | Kabushiki Kaisha Yoshiba | Mask processing apparatus and mask processing method |
US20190151993A1 (en) * | 2017-11-22 | 2019-05-23 | Asm Technology Singapore Pte Ltd | Laser-cutting using selective polarization |
CN109014566B (en) * | 2018-10-16 | 2021-04-06 | 北京理工大学 | Method for simply controlling arrangement direction of laser-induced surface periodic structure |
CN110899957B (en) * | 2019-11-27 | 2021-01-15 | 西安交通大学 | Method for realizing information display and encryption based on femtosecond laser induced segmentation pattern |
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US5057664A (en) * | 1989-10-20 | 1991-10-15 | Electro Scientific Industries, Inc. | Method and apparatus for laser processing a target material to provide a uniformly smooth, continuous trim profile |
US6090507A (en) * | 1997-01-21 | 2000-07-18 | International Business Machines Corporation | Methods for repair of photomasks |
US6120725A (en) * | 1997-07-25 | 2000-09-19 | Matsushita Electric Works, Ltd. | Method of forming a complex profile of uneven depressions in the surface of a workpiece by energy beam ablation |
US6333485B1 (en) * | 1998-12-11 | 2001-12-25 | International Business Machines Corporation | Method for minimizing sample damage during the ablation of material using a focused ultrashort pulsed beam |
US20030226830A1 (en) * | 2002-06-10 | 2003-12-11 | New Wave Research | Scribing sapphire substrates with a solid state UV laser |
US20050205538A1 (en) * | 2004-03-22 | 2005-09-22 | Ming Li | Method of controlling hole shape during ultrafast laser machining by manipulating beam polarization |
US6951627B2 (en) * | 2002-04-26 | 2005-10-04 | Matsushita Electric Industrial Co., Ltd. | Method of drilling holes with precision laser micromachining |
-
2007
- 2007-01-18 US US11/624,257 patent/US7732104B2/en not_active Expired - Fee Related
-
2010
- 2010-02-25 US US12/712,513 patent/US20100219168A1/en not_active Abandoned
Patent Citations (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5057664A (en) * | 1989-10-20 | 1991-10-15 | Electro Scientific Industries, Inc. | Method and apparatus for laser processing a target material to provide a uniformly smooth, continuous trim profile |
US6090507A (en) * | 1997-01-21 | 2000-07-18 | International Business Machines Corporation | Methods for repair of photomasks |
US6156461A (en) * | 1997-01-21 | 2000-12-05 | International Business Machines Corporation | Method for repair of photomasks |
US6165649A (en) * | 1997-01-21 | 2000-12-26 | International Business Machines Corporation | Methods for repair of photomasks |
US6190836B1 (en) * | 1997-01-21 | 2001-02-20 | International Business Machines Corporation | Methods for repair of photomasks |
US6120725A (en) * | 1997-07-25 | 2000-09-19 | Matsushita Electric Works, Ltd. | Method of forming a complex profile of uneven depressions in the surface of a workpiece by energy beam ablation |
US6333485B1 (en) * | 1998-12-11 | 2001-12-25 | International Business Machines Corporation | Method for minimizing sample damage during the ablation of material using a focused ultrashort pulsed beam |
US6951627B2 (en) * | 2002-04-26 | 2005-10-04 | Matsushita Electric Industrial Co., Ltd. | Method of drilling holes with precision laser micromachining |
US20030226830A1 (en) * | 2002-06-10 | 2003-12-11 | New Wave Research | Scribing sapphire substrates with a solid state UV laser |
US20050205538A1 (en) * | 2004-03-22 | 2005-09-22 | Ming Li | Method of controlling hole shape during ultrafast laser machining by manipulating beam polarization |
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US20080176147A1 (en) | 2008-07-24 |
US7732104B2 (en) | 2010-06-08 |
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