US9767833B1 - Wire bonding electrical lapping guides for tape head module - Google Patents
Wire bonding electrical lapping guides for tape head module Download PDFInfo
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- US9767833B1 US9767833B1 US15/237,345 US201615237345A US9767833B1 US 9767833 B1 US9767833 B1 US 9767833B1 US 201615237345 A US201615237345 A US 201615237345A US 9767833 B1 US9767833 B1 US 9767833B1
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- tape head
- head module
- lapping
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- external circuit
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- 238000013459 approach Methods 0.000 description 5
- 238000005516 engineering process Methods 0.000 description 4
- 238000013500 data storage Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 238000010348 incorporation Methods 0.000 description 3
- 150000003071 polychlorinated biphenyls Chemical class 0.000 description 3
- 239000010409 thin film Substances 0.000 description 3
- 230000008901 benefit Effects 0.000 description 2
- 238000003754 machining Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 238000003860 storage Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
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Images
Classifications
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- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
- G11B5/127—Structure or manufacture of heads, e.g. inductive
- G11B5/187—Structure or manufacture of the surface of the head in physical contact with, or immediately adjacent to the recording medium; Pole pieces; Gap features
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
- G11B5/127—Structure or manufacture of heads, e.g. inductive
- G11B5/31—Structure or manufacture of heads, e.g. inductive using thin films
- G11B5/3163—Fabrication methods or processes specially adapted for a particular head structure, e.g. using base layers for electroplating, using functional layers for masking, using energy or particle beams for shaping the structure or modifying the properties of the basic layers
- G11B5/3169—Working or finishing the interfacing surface of heads, e.g. lapping of heads
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B21/00—Head arrangements not specific to the method of recording or reproducing
- G11B21/16—Supporting the heads; Supporting the sockets for plug-in heads
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
- G11B5/008—Recording on, or reproducing or erasing from, magnetic tapes, sheets, e.g. cards, or wires
- G11B5/00813—Recording on, or reproducing or erasing from, magnetic tapes, sheets, e.g. cards, or wires magnetic tapes
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- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
- G11B5/10—Structure or manufacture of housings or shields for heads
- G11B5/102—Manufacture of housing
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- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
- G11B5/10—Structure or manufacture of housings or shields for heads
- G11B5/105—Mounting of head within housing or assembling of head and housing
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
- G11B5/127—Structure or manufacture of heads, e.g. inductive
- G11B5/1272—Assembling or shaping of elements
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
- G11B5/127—Structure or manufacture of heads, e.g. inductive
- G11B5/29—Structure or manufacture of unitary devices formed of plural heads for more than one track
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
- G11B5/127—Structure or manufacture of heads, e.g. inductive
- G11B5/29—Structure or manufacture of unitary devices formed of plural heads for more than one track
- G11B5/295—Manufacture
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
- G11B5/127—Structure or manufacture of heads, e.g. inductive
- G11B5/31—Structure or manufacture of heads, e.g. inductive using thin films
- G11B5/3163—Fabrication methods or processes specially adapted for a particular head structure, e.g. using base layers for electroplating, using functional layers for masking, using energy or particle beams for shaping the structure or modifying the properties of the basic layers
- G11B5/3166—Testing or indicating in relation thereto, e.g. before the fabrication is completed
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
- G11B5/127—Structure or manufacture of heads, e.g. inductive
- G11B5/31—Structure or manufacture of heads, e.g. inductive using thin films
- G11B5/3163—Fabrication methods or processes specially adapted for a particular head structure, e.g. using base layers for electroplating, using functional layers for masking, using energy or particle beams for shaping the structure or modifying the properties of the basic layers
- G11B5/3173—Batch fabrication, i.e. producing a plurality of head structures in one batch
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
- G11B5/48—Disposition or mounting of heads or head supports relative to record carriers ; arrangements of heads, e.g. for scanning the record carrier to increase the relative speed
- G11B5/4806—Disposition or mounting of heads or head supports relative to record carriers ; arrangements of heads, e.g. for scanning the record carrier to increase the relative speed specially adapted for disk drive assemblies, e.g. assembly prior to operation, hard or flexible disk drives
- G11B5/4853—Constructional details of the electrical connection between head and arm
Definitions
- Embodiments of the invention may relate generally to magnetic tape heads and more particularly to wire bonding electrical lapping guides to an external circuit.
- magnetic tape continues to be a cost-efficient and reliable storage medium for non-volatile data storage.
- Conventional magnetic tape heads typically include tape head elements, i.e., very small magnetic read-write transducers, formed from films that are deposited over a substrate.
- tape head elements are commonly fabricated using thin film wafer technology, including machining the elements to a desired height by a process referred to as lapping.
- lapping For magnetic tape heads that have a magneto-resistive reader element, the desired height is commonly referred to as the “stripe height”, and for the writer element, the “throat height”.
- Improvements in magnetic tape head technology are achievable, such as in data storage capacity, based on improvements in tape head manufacturing processes.
- Precise control of the critical dimensions of the reader element (e.g., the stripe height) and the writer element (e.g., the throat height), by way of lapping, is commonly practiced and is a fundamental manufacturing process. For optimum yield, performance and stability, precise dimensional control over both the reader and/or writer elements is desirable.
- Embodiments of the invention are generally directed toward a process or method for manufacturing a magnetic tape head module, a magnetic tape head module prepared according to such a process, and a magnetic tape recording and playback device comprising a magnetic tape head module prepared according to such a process.
- the manufacturing process involves depositing over a wafer substrate one or more electrical traces from respective one or more electrical lapping guides (ELGs) to an area at an end of a tape head module also formed over the substrate, fabricating a closure adjacent to the tape head module wherein the closure terminates outside of the area at the end of the tape head module, and electrically connecting the electrical traces to an external circuit using a wire-bonding procedure thereby electrically connecting each ELG to the external circuit.
- Embodiments may further include lapping the tape head module using the ELGs for resistance feedback.
- Embodiments may include depositing a plurality of electrical connection pads at the area at the end of the tape head module, and electrically connecting each electrical trace to one of the pads, wherein electrically connecting the traces to the external circuit includes wire-bonding the pads to the circuit.
- Embodiments discussed in the Summary of Embodiments section are not meant to suggest, describe, or teach all the embodiments discussed herein.
- embodiments of the invention may contain additional or different features than those discussed in this section.
- FIG. 1 is a diagram illustrating a process for manufacturing a tape head module, according to an embodiment
- FIG. 2 is a perspective view illustrating an end portion of a conventional segment of devices for incorporation into a tape head module
- FIG. 3A is a perspective view illustrating a tape head module, according to an embodiment
- FIG. 3B is a magnified perspective view illustrating an end portion of the tape head module of FIG. 3A , according to an embodiment
- FIG. 3C is a perspective view illustrating a segment comprising a plurality of closures, according to an embodiment
- FIG. 4 is a flowchart illustrating a method for manufacturing a tape head module, according to an embodiment
- FIG. 5 is a perspective view illustrating a tape head module rough-lap tooling configuration, according to an embodiment.
- FIG. 6 is a perspective view illustrating a tape head module fine-lap tooling configuration, according to an embodiment.
- substantially will be understood to describe a feature that is largely or nearly structured, configured, dimensioned, etc., but with which manufacturing tolerances and the like may in practice result in a situation in which the structure, configuration, dimension, etc. is not always or necessarily precisely as stated. For example, describing a structure as “substantially vertical” would assign that term its plain meaning, such that the sidewall is vertical for all practical purposes but may not be precisely at 90 degrees.
- ELG electrical lapping guide
- Stripe height is an important parameter that affects the signal output (e.g., signal-to-noise ratio, or SNR) of the reader element, e.g., the sensitivity of the reader to a magnetic field.
- SNR signal-to-noise ratio
- next generation lapping tools/technology can provide much improved stripe height control (e.g., currently on the order of roughly 100 ⁇ better stripe height control, in the form of lower sigmas across a row)
- a different technique for electrically connecting the ELGs which is compatible with this next generation lapping tooling, is desirable.
- High-volume magnetic thin film head fabrication involves high precision subtractive machining performed in discrete material removal steps.
- processing starts with a completed thin film head wafer which may consist of thousands of magnetic devices, and is completed when all the devices are individuated and meet numerous and stringent specifications.
- the individual devices ultimately become part of tape head modules housing a plurality of the magnetic devices, e.g., read-write heads. Therefore, precise control of the reader dimension and of the alignment of the reader and writer relative to each other are critical components of the read-write head fabrication process, in order to achieve optimum yield, performance, and stability.
- FIG. 1 is a diagram illustrating a process for manufacturing a tape head module, according to an embodiment.
- FIG. 1 illustrates the process with a series of images representing a sequence of actions illustrative of the process.
- the process depicted in FIG. 1 is an example, and an implementation of the process may include additional or fewer actions than that depicted.
- FIG. 1 illustrates a wafer 102 on which a plurality of MR devices may be fabricated.
- the exact configuration of wafer 102 may vary from implementation to implementation, and that illustrated in FIG. 1 is for purposes of a non-limiting example only.
- multiple rows of devices are deposited simultaneously on a wafer substrate.
- devices and auxiliary circuits are fabricated on a common wafer substrate typically using, for non-limiting examples, deposition, photolithography, etching, and/or lift-off processes.
- These auxiliary circuits are what are referred to herein as electrical lapping guides (ELGs), or electronic lapping guides.
- Wafer 102 is cut into a plurality of segments 104 (sometimes called “quads”), with each segment 104 typically comprising multiple columns 105 (here, two columns) of multiple rows 106 of devices for incorporation into a tape head module.
- a segment of closures 108 is fabricated (e.g., using slicing and/or grinding operations) and bonded to a segment 104 of the wafer 102 . Once bonded, the segment of closures 108 is typically ground down to fabricate an assembly 110 in which there is a closure between adjacent pairs of rows 106 of devices of the segment 104 .
- a segment of closures 108 once bonded to a segment 104 of devices, ensures proper tape contact on the tape bearing surfaces of the tape head module and may assist with reducing the wear of the transducers during operation.
- the closures 108 define slots 111 in which a row 106 of devices, and aforementioned ELGs, are positioned.
- the assembly 110 (i.e., segment 104 with closures 108 affixed thereto) may be fixed to a carrier 112 for rough lapping each row 106 of the tape head modules/devices to target height(s).
- a carrier 112 for rough lapping each row 106 of the tape head modules/devices to target height(s).
- the lapped row 106 is sliced off, resulting is an assembly 110 that is reduced in size by one row. This is then repeated until all the rows 106 are rough lapped and sliced off.
- the assembly 110 may be sliced into rows of tape head modules, e.g., each of the rows 106 is separated, and then fixed to the carrier 112 for lapping the tape head modules/devices to target height(s).
- the ELGs are utilized to define the target height of the tape head elements, such as the reader stripe height and/or writer throat height.
- ELGs may be spaced uniformly along the tape head module or an ELG may be positioned on each side of one or more of the reader and/or writer elements (or elsewhere) and is lapped along with these elements, thereby providing resistive feedback for the lapping process by effectively measuring the element height(s) during the lapping process.
- the rows 106 first undergo an intermediate rough-lap process generally to reach a element height close to or at the target height, and then fine-lapped (or “final lapped” or “final precision-lapped”) to reach the target height and/or a desired surface finish. Once lapped, each row 106 may be further trimmed into a tape head chiplet 114 , which is bonded or otherwise affixed to a rigid U-beam 116 to form a more robust, stable tape head module for operational use thereof.
- FIG. 2 is a perspective view illustrating an end portion of a conventional segment of devices for incorporation into a tape head module. Depicted in FIG. 2 is an assembly such as assembly 110 ( FIG. 1 ) comprising alternating closures 108 and slots 111 . Within a slot 111 is depicted multiple ELG electrical connection pads 202 (or simply “ELG pads”). While the closures 108 are beneficial for reasons discussed, the closures 108 tend to complicate the lapping processes because they get in the way of electrically connecting the ELG pads 202 to the lapping PCB.
- ELG electrical connection pads 202 or simply “ELG pads”. While the closures 108 are beneficial for reasons discussed, the closures 108 tend to complicate the lapping processes because they get in the way of electrically connecting the ELG pads 202 to the lapping PCB.
- the aforementioned pogo pins are historically used to electrically connect the ELGs with the lapping PCB via the lapping cable and which, as discussed, can inhibit the use of next generation lapping tools/fixtures.
- FIG. 3A is a perspective view illustrating a tape head module
- FIG. 3B is a magnified perspective view illustrating an end portion of the tape head module of FIG. 3A
- FIG. 3C is a perspective view illustrating a segment comprising a plurality of closures, all according to embodiments.
- FIG. 4 is a flowchart illustrating a method for manufacturing a tape head module, according to an embodiment.
- FIGS. 3A-3C are presented in reference to, and to help describe and illustrate, the method of FIG. 4 .
- one or more electrical traces are deposited over a wafer substrate, from respective one or more electrical lapping guides to an area at an end of a tape head module formed over the substrate.
- electrical traces 302 (depicted in a simplified configuration for example and clarity) are embedded in or on tape head module 300 , leading from ELGs 304 (e.g., located under/beneath closure 308 ; each depicted simply as a vertical dashed line) to an area 306 at the end of the tape head module 300 . While electrical traces 302 are depicted visible in FIGS.
- such traces 302 may be embedded in one or more inner layers of the tape head module 300 and not necessarily in the visible outermost layer or surface of tape head module 300 as depicted.
- the manner in which electrical traces 302 are formed may vary from implementation to implementation.
- the traces 302 may be deposited in a layer and etched therefrom.
- the number of ELGs 304 illustrated in FIG. 3A is for purposes of example, where the actual number of ELGs 304 for a given tape head module 300 may vary from implementation to implementation.
- a closure is fabricated adjacent to magnetic devices of the tape head module, wherein the closure terminates outside of the area at the end of the tape head module.
- closure 308 is fabricated adjacent to or over a set of magnetic devices 310 (e.g., located under/beneath closure 308 ; each depicted simply as a vertical dashed line) of the tape head module 300 , where each of the magnetic devices 310 is electrically connected to a corresponding electrical connection pad 309 .
- the number of magnetic devices 310 illustrated in FIG. 3A is for purposes of example, where the actual number of magnetic devices 310 for a given tape head module 300 may vary from implementation to implementation.
- FIG. 3C depicts a segment 350 comprising a plurality of closures 308 (not all pointed to with element number lead lines) bonded or otherwise affixed to the segment 350 of tape head modules (see, e.g., segment 104 of FIG. 1 ), with slots 311 between adjacent closures 308 .
- closure 308 does not span the entire length of the tape head module 300 , but terminates outside of or prior to the area 306 at the end of the tape head module 300 .
- the electrical traces are electrically connected to an external circuit using a wire-bonding procedure, thereby electrically connecting each electrical lapping guide to the external circuit.
- Wire bonding is a well-established technique for interconnecting integrated circuits (IC) or other semiconductor devices, and may be used in conjunction with vision alignment techniques such as machine vision.
- FIG. 5 is a perspective view illustrating a tape head module “rough-lap” tooling configuration, according to an embodiment.
- tape head module 300 comprising a closure 308 terminating outside of the area 306 at the end of tape head module 300 , is installed in a tooling fixture (or “carrier”), and electrically connected to an external circuit 502 using a plurality of wire bonds 504 a , 504 b , 504 c , 504 d from electrical connection pads 312 at respective areas 306 a , 306 b , 306 c , 306 d at the end of each tape head module 300 .
- a tooling fixture or “carrier”
- FIG. 6 is a perspective view illustrating a tape head module “fine-lap” tooling configuration, according to an embodiment.
- tape head module 300 comprising a closure 308 terminating outside of the area 306 at the end of tape head module 300 , is installed in a tooling fixture (or “carrier”), and electrically connected to an external circuit 602 using a plurality of wire bonds 604 a , 604 b , 604 c , 604 d from electrical connection pads 312 at respective areas 306 a , 306 b , 306 c , 306 d at the end of each tape head module 300 .
- the tape head module is lapped using the electric lapping guides for resistance feedback.
- a rough-lap procedure is performed on the pair of tape head modules 300 , using ELGs 304 ( FIG. 3A ) for resistance feedback.
- the resistance of each ELG 304 is monitored during the lapping procedure to determine the stripe height of the associated magnetic devices 310 ( FIG. 3A ), with the lapping procedure programmed to terminate when the ELG 304 resistance (e.g., individually or collectively) reaches a predetermined value corresponding to a target stripe height of the magnetic devices 310 .
- the ELG 304 resistance e.g., individually or collectively
- a fine-lap procedure is performed on the pair of tape head modules 300 , using ELGs 304 ( FIG. 3A ) for resistance feedback.
- the resistance of each ELG 304 is monitored during the lapping procedure to determine the stripe height of the associated magnetic device 310 ( FIG. 3A ), with the lapping procedure programmed to terminate when the ELG 304 resistance reaches a predetermined value corresponding to a target stripe height of the magnetic devices 310 .
- a plurality of electrical connection pads are deposited at the area at the end of the tape head module.
- electrical connection pads 312 are deposited onto the tape head module 300 (e.g., onto the wafer 102 of FIG. 1 ) at the area(s) 306 at the end of the module 300 , outside of or clear of the closure 308 . See also areas 306 a , 306 b , 306 c , 306 d of FIGS. 5 and 6 , for areas at which electrical connection pads 312 may be located.
- each electrical trace is electrically connected to one of the connection pads.
- each electrical trace 302 ( FIG. 3B ) is electrically connected to one of the electrical connection pads 312 ( FIG. 3B ).
- wire-bonding the electrical traces 302 to the external circuit would include wire-bonding the electrical connection pads 312 to the external PCBs, because the electrical traces 302 are electrically connected with the electrical connection pads 312 , which are wire-bonded (e.g., see wire bonds 504 a , 504 b , 540 c , 504 d of FIG. 5 and wire bonds 604 a , 604 b , 604 c , 604 d of FIG. 6 ) to the external PCBs.
Abstract
Description
Claims (20)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
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US15/237,345 US9767833B1 (en) | 2016-08-15 | 2016-08-15 | Wire bonding electrical lapping guides for tape head module |
CN201710446719.1A CN107767882B (en) | 2016-08-15 | 2017-06-14 | Guiding element is ground for the wire bonding electricity with head module |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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US15/237,345 US9767833B1 (en) | 2016-08-15 | 2016-08-15 | Wire bonding electrical lapping guides for tape head module |
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US9767833B1 true US9767833B1 (en) | 2017-09-19 |
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US15/237,345 Active US9767833B1 (en) | 2016-08-15 | 2016-08-15 | Wire bonding electrical lapping guides for tape head module |
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US (1) | US9767833B1 (en) |
CN (1) | CN107767882B (en) |
Citations (12)
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US20030123185A1 (en) * | 2001-12-28 | 2003-07-03 | Denison Edward V. | Servo write head with gaps for writing high and low frequency transitions |
US7116519B2 (en) | 2003-12-15 | 2006-10-03 | International Business Machines Corporation | Patterning of integrated closure for implementing pads connected to lapping elements |
US20070103812A1 (en) * | 2005-11-09 | 2007-05-10 | Biskeborn Robert G | Magnetic head closure bond using metal adhesion |
US7290325B2 (en) | 2004-08-13 | 2007-11-06 | Quantum Corporation | Methods of manufacturing magnetic heads with reference and monitoring devices |
US7369369B1 (en) * | 2003-04-03 | 2008-05-06 | Meyer Dallas W | Bidirectional micropositioning recording head for a magnetic storage device |
US20090201613A1 (en) * | 2008-02-07 | 2009-08-13 | Robert Glenn Biskeborn | Magnetic head with interconnect element |
US7757383B2 (en) | 2001-08-23 | 2010-07-20 | International Business Machines Corporation | System for lapping a head having an electrical lapping guide (ELG) on a wafer |
US7841069B2 (en) | 2007-08-30 | 2010-11-30 | International Business Machines Corporation | Method for manufacturing a thin closure magnetic head |
US7963023B2 (en) | 2007-11-16 | 2011-06-21 | Oracle America, Inc. | Process for accurately machining a magnetic tape head |
US20120074978A1 (en) * | 2010-09-27 | 2012-03-29 | International Business Machines Corporation | Methods and systems for detecting esd events in cabled devices |
US20150007430A1 (en) | 2013-07-02 | 2015-01-08 | Seagate Technology Llc | Lapping carrier |
US9093087B2 (en) * | 2013-09-16 | 2015-07-28 | International Business Machines Corporation | Apparatus with a lapping guide within a span of the transducer array |
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CN1178965A (en) * | 1996-10-03 | 1998-04-15 | 昆腾公司 | Multi-track transmission lines for R/W head interconnect in hard disk drive |
US8598460B2 (en) * | 2010-12-22 | 2013-12-03 | HGST Netherlands B.V. | Interleaved conductor structure with offset traces |
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2016
- 2016-08-15 US US15/237,345 patent/US9767833B1/en active Active
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2017
- 2017-06-14 CN CN201710446719.1A patent/CN107767882B/en active Active
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US20030123185A1 (en) * | 2001-12-28 | 2003-07-03 | Denison Edward V. | Servo write head with gaps for writing high and low frequency transitions |
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CN107767882A (en) | 2018-03-06 |
CN107767882B (en) | 2019-09-24 |
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