WO2008089665A1 - Tape head method and assembly utilizing split tape stabilizer design - Google Patents

Tape head method and assembly utilizing split tape stabilizer design Download PDF

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Publication number
WO2008089665A1
WO2008089665A1 PCT/CN2008/000144 CN2008000144W WO2008089665A1 WO 2008089665 A1 WO2008089665 A1 WO 2008089665A1 CN 2008000144 W CN2008000144 W CN 2008000144W WO 2008089665 A1 WO2008089665 A1 WO 2008089665A1
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WO
WIPO (PCT)
Prior art keywords
head
tape
stabilizer
tape head
interface area
Prior art date
Application number
PCT/CN2008/000144
Other languages
French (fr)
Inventor
Chuck Fai Lam
Original Assignee
Lafe Computer Magnetics Limited
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lafe Computer Magnetics Limited filed Critical Lafe Computer Magnetics Limited
Publication of WO2008089665A1 publication Critical patent/WO2008089665A1/en

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Classifications

    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11BINFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B5/00Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
    • G11B5/008Recording on, or reproducing or erasing from, magnetic tapes, sheets, e.g. cards, or wires
    • G11B5/00813Recording on, or reproducing or erasing from, magnetic tapes, sheets, e.g. cards, or wires magnetic tapes
    • G11B5/00817Recording on, or reproducing or erasing from, magnetic tapes, sheets, e.g. cards, or wires magnetic tapes on longitudinal tracks only, e.g. for serpentine format recording
    • G11B5/00821Recording on, or reproducing or erasing from, magnetic tapes, sheets, e.g. cards, or wires magnetic tapes on longitudinal tracks only, e.g. for serpentine format recording using stationary heads
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11BINFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B5/00Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
    • G11B5/48Disposition or mounting of heads or head supports relative to record carriers ; arrangements of heads, e.g. for scanning the record carrier to increase the relative speed
    • G11B5/488Disposition of heads
    • G11B5/4893Disposition of heads relative to moving tape
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11BINFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B15/00Driving, starting or stopping record carriers of filamentary or web form; Driving both such record carriers and heads; Guiding such record carriers or containers therefor; Control thereof; Control of operating function
    • G11B15/60Guiding record carrier

Definitions

  • the present invention relates to magnetic tape read/write heads, and more specifically, to the fabrication of magnetic tape heads designed to maintain contact between a magnetic tape and the tape head when tape wrap angle varies and thereby also varies the head edge pressure on the tape.
  • the over-wrap angle is a result of the tape wrap angle and the head contour design.
  • the wrap angle (Normally around 5—12 ? is defined by the configuration of the tape drive.
  • Figure 1 illustrates the wrap angle.
  • Tape head 1 has selected contour.
  • Tape 3 forms an angle with a line extending tangentially from the contour of tape head 1 at its edge, thus forming over-wrap angle 5.
  • the wrap angle normally varies within certain values, (normally +/-1? due to drive assembly process tolerance. A low tape wrap angle is likely to cause insufficient air bleeding and result in tape lift off from recording gap. A relative large wrap angle will cause large pressure at the edge of the tape head, which will cause tape wear problems in a drive application.
  • the most common method to eliminate the tape wrap angle variation is implement a tape stabilizer element separated but parallel to recording head. An illustration of this is shown in Figure 2. Tape head 101 and stabilizer 103 are fromed from block 103. The tape wrap angle variation will be absorbed by tape stabilizer because the tape passes over the tape stabilizer first before passing over recording element. [0005] A prior art process for forming such a stabilizer bump is shown in Figures 3-5.
  • Figure 3 shows a monolithic block 103 with embedded transducers 105. A method forming block 103 including embedded transducers 105 canjbe found Jn Lam, et_al.,U.S
  • Patent No. 6,950,289 which is fully incorporated herein by reference.
  • the face 107 of block 103 has been ground to provide a desired profile.
  • a gap 109 is cut between read/write head 111 and stabilizer 113.
  • the radius of curvature and the center of curvature of this profile formed in Figure 3 are selected for maximum read/write head performance.
  • the process of Figures 3-5 forms a tape stabilizer bump that is integrated with recording element$ ⁇ bump.
  • the difficulty of controlling the dimensions and profile of both the data island 115 (read/write head 111) and the profile of the outrigger island 117 (stabilizer 113) dimension during manufacturing process is high.
  • the most economical method uses the same radius and center of curvature for both profile 115 and 117.
  • the tape stabilizer bump and recording element bump are designed with different dimensions and profiles to achieve a optimized head/tape interface. So the process of Figures 3-5 is not cannot achieve a good head ⁇ ape interface and process yield.
  • the process must be compromised to form the profile of both the profile of tape stabilizer bump and recording element bump, which does not form the optimized profile of both the profile of tape stabilizer bump and recording element bump. Meanwhile, this process causes high manufacturing costs because of the expensive, high precision equipment required to cut gap 109 in the step of Figure 5. In addition, a high precision cutting blade must be used to prevent chips/cracks along the slotting edge. Even with such expensive equipment, the process of Figure 5 is prone to error, thus reducing the yield of read/write heads due to scrappage.
  • the described embodiments ⁇ f the pi ⁇ ent inv «ition include_at ⁇ )e head assembly and a method for forming the tape head assembly where a tape head is formed having a first profile and having an stabilizer head interface area. A stabilizer head is formed having a second profile and having a tape head interface area. The tape head assembly and stabilizer head are then bonded by bonding the stabilizer head interface area to the tape head interface area such that the tape head and the stabilizer head have a desired configuration relative to each other and such that a gap is formed between the tape head and the stabilizer head.
  • the stabilizer head interface area to the tape head interface area are adhesively bonded.
  • Figure 1 is a side view of a tape head illustrating the concept of a wrap angle
  • Figure 2 is a side view of a prior art tape head and stabilizer combination
  • Figures 3-5 are side view illustrating a prior art process for forming the tape head stabilizer combination of Figure 1;
  • Figure 6-8 are side view illustrating a process that is one embodiment of the invention.
  • FIG. 6 is a side view showing the initial step to a process that is one embodiment of the present invention.
  • Tape head block 203 A is formed with read/write transducers 205 using known techniques such as that of U.S. Patent No. 6,950,289. Briefly, conductive coils (write) and magnetically sensitive material such as AMR/GMR element (read) (collectively transducers 205) are formed on a substrate using a suitable technique such as photolithographic techniques. The tape bearing surface is then lapped to provide precise spacing from transducers 205 to the tape bearing surface of the head.
  • Stabilizer block 203B is monolithic. Both blocks are formed of a material that has high wear resistance, high strength, is not easily fractured and has good electrical conductivity.
  • One such material is alumina titanium carbide (Al 2 OaZTiC), which is a ceramic material, however, other materials may be advantageously employed.
  • tape head block 203A is machined to form tape head 211 having an optimal profile 212.
  • stabilizer block 203B is machined to form stabilizer 213 having profile 214 which is optimal for the stabilizer function. Because blocks 203 A and 203 B are separately machined, profile 212 and profile 214 can be different without the need for expensive precision machinery capable of forming different profiles from the same block of material.
  • tape head block 203 A is bonded to stabilizer block 203B.
  • a precison alignment of the stabilizer 213 relative to the tape head 211 is necessary.
  • this alignment process can be used to compensate for variability in the formation of stabilizer 213 or tape head 211, while providing proper alignment between these two components.
  • a product specified alignment tool is recommended for the alignment process to ensure that the distance, angle and relative height are controlled between stablizer 213 and tape head 211.
  • stabilizer block 203B to tape head block 203 A is preferably achieved using a high strength adhesive, such as UV glue.
  • a high strength adhesive such as UV glue.
  • bonding techniques known in the art may be used effectively depending on the materials used.
  • Example alternative techniques are welding and soldering.
  • the final assembly 220 is shown in Figure 8.
  • the profiles 212 and 214 of tape head 211 and stabilizer 213, respectively, are optimal for their respective functions.
  • stabilizer 213 is specifically aligned at the last step of assembly, the over-wrap angle 224 at the point where the tape 222 moves onto tape head 211 can be precisely controlled. This improves performance by minimizing the air bearing formed on tape head 211 as tape 222 moves across tape head 211.

Abstract

A magnetic tape head assembly with split tape stabilizer element can eliminate the variation of tape wrap angle caused by drive manufacturing and reduce tape wear by reduce tape over-wrap angle on head. The magnetic tape head assembly comprises a recording gap, containing read/write element, and a split tape stabilizer element to support tape before tape passes through recording gap across the width of the head. The split tape stabilizer is aligned with the read/write element along the recording gap and this relationship is fixed by bonding the two components together. A tape head is formed having a first profile and having a stabilizer head interface area. A stabilizer head is formed having a second profile and having a tape head interface area. The tape head assembly and stabilizer head are then bonded by bonding the stabilizer head interface area to the tape head interface area such that the tape head and the stabilizer head have a desired configuration relative to each other and such that a gap is formed between the tape head and the stabilizer head.

Description

TAPE HEAD METHOD AND ASSEMBLY UTILIZING SPLIT TAPE STABILIZER DESIGN
FIELD OF THE INVENTION
[0001] The present invention relates to magnetic tape read/write heads, and more specifically, to the fabrication of magnetic tape heads designed to maintain contact between a magnetic tape and the tape head when tape wrap angle varies and thereby also varies the head edge pressure on the tape.
BACKGROUND OF THE INVENTION
[0002] As a tape moves over a tape head, an air bearing tends to form under the tape. This air bearing lifts the tape off the head, interfering with the read and write functionality of the tape head. In order to deal with this air bearing interference, tape heads were designed with an over-wrap angle to bleeding out the air before the tape enters the gap.
[0003] The over-wrap angle is a result of the tape wrap angle and the head contour design. The wrap angle (Normally around 5—12 ? is defined by the configuration of the tape drive. Figure 1 illustrates the wrap angle. Tape head 1 has selected contour. Tape 3 forms an angle with a line extending tangentially from the contour of tape head 1 at its edge, thus forming over-wrap angle 5.
[0004] The wrap angle normally varies within certain values, (normally +/-1? due to drive assembly process tolerance. A low tape wrap angle is likely to cause insufficient air bleeding and result in tape lift off from recording gap. A relative large wrap angle will cause large pressure at the edge of the tape head, which will cause tape wear problems in a drive application. The most common method to eliminate the tape wrap angle variation is implement a tape stabilizer element separated but parallel to recording head. An illustration of this is shown in Figure 2. Tape head 101 and stabilizer 103 are fromed from block 103. The tape wrap angle variation will be absorbed by tape stabilizer because the tape passes over the tape stabilizer first before passing over recording element. [0005] A prior art process for forming such a stabilizer bump is shown in Figures 3-5. Figure 3 shows a monolithic block 103 with embedded transducers 105. A method forming block 103 including embedded transducers 105 canjbe found Jn Lam, et_al.,U.S
Patent No. 6,950,289, which is fully incorporated herein by reference. In Figure 4, the face 107 of block 103 has been ground to provide a desired profile. Next a gap 109 is cut between read/write head 111 and stabilizer 113. The radius of curvature and the center of curvature of this profile formed in Figure 3 are selected for maximum read/write head performance.
[0006] The process of Figures 3-5 forms a tape stabilizer bump that is integrated with recording element$ϋbump. However, the difficulty of controlling the dimensions and profile of both the data island 115 (read/write head 111) and the profile of the outrigger island 117 (stabilizer 113) dimension during manufacturing process is high. In the process shown in Figures 3-5, the most economical method uses the same radius and center of curvature for both profile 115 and 117. But in many cases, the tape stabilizer bump and recording element bump are designed with different dimensions and profiles to achieve a optimized head/tape interface. So the process of Figures 3-5 is not cannot achieve a good headΛape interface and process yield. The process must be compromised to form the profile of both the profile of tape stabilizer bump and recording element bump, which does not form the optimized profile of both the profile of tape stabilizer bump and recording element bump. Meanwhile, this process causes high manufacturing costs because of the expensive, high precision equipment required to cut gap 109 in the step of Figure 5. In addition, a high precision cutting blade must be used to prevent chips/cracks along the slotting edge. Even with such expensive equipment, the process of Figure 5 is prone to error, thus reducing the yield of read/write heads due to scrappage.
[0007] Therefore, a head assembly with tape stabilizer bump with easy dimensional and profile control of the read/write head and the stabilizer is desirable. Further, a head assembly process with a low manufacture cost is desirable. SUMMARY OF THE INVENTION
[0008] The described embodiments ^f the pi^ent inv«ition include_at^)e head assembly and a method for forming the tape head assembly where a tape head is formed having a first profile and having an stabilizer head interface area. A stabilizer head is formed having a second profile and having a tape head interface area. The tape head assembly and stabilizer head are then bonded by bonding the stabilizer head interface area to the tape head interface area such that the tape head and the stabilizer head have a desired configuration relative to each other and such that a gap is formed between the tape head and the stabilizer head. In one embodiment, the stabilizer head interface area to the tape head interface area are adhesively bonded.
[0009] Using the described method, because the tape head and stabilizer are manufactured separately, it is easy to provide separate profiles for both components. This process individually forms the profile and dimension of recording element bump and tape stabilizer bump. The profile and dimension of tape head and stabilizer can be accurately controlled according to design requirement to achieve optimized head/tape interface. Also with this process there is no need for expensive equipment to form the slot between the tape head and the stabilizer. In addition, to improve the quality by remove the chip/rack in island edge formed during slotting process before final contour formed to reduce tape wear in drive.
SUMMARY OF THE DRAWINGS
[0010] Figure 1 is a side view of a tape head illustrating the concept of a wrap angle;
[0011] Figure 2 is a side view of a prior art tape head and stabilizer combination;
[0012] Figures 3-5 are side view illustrating a prior art process for forming the tape head stabilizer combination of Figure 1; [0013] Figure 6-8 are side view illustrating a process that is one embodiment of the invention.
DETAILED DESCRIPTION OF THE INVENTION
[0014] Figure 6 is a side view showing the initial step to a process that is one embodiment of the present invention. Tape head block 203 A is formed with read/write transducers 205 using known techniques such as that of U.S. Patent No. 6,950,289. Briefly, conductive coils (write) and magnetically sensitive material such as AMR/GMR element (read) (collectively transducers 205) are formed on a substrate using a suitable technique such as photolithographic techniques. The tape bearing surface is then lapped to provide precise spacing from transducers 205 to the tape bearing surface of the head.
[0015] Stabilizer block 203B is monolithic. Both blocks are formed of a material that has high wear resistance, high strength, is not easily fractured and has good electrical conductivity. One such material is alumina titanium carbide (Al2OaZTiC), which is a ceramic material, however, other materials may be advantageously employed.
[0016] As shown in Figure 7, tape head block 203A is machined to form tape head 211 having an optimal profile 212. Similarly, stabilizer block 203B is machined to form stabilizer 213 having profile 214 which is optimal for the stabilizer function. Because blocks 203 A and 203 B are separately machined, profile 212 and profile 214 can be different without the need for expensive precision machinery capable of forming different profiles from the same block of material.
[0017] To complete the assembly, tape head block 203 A is bonded to stabilizer block 203B. With this embodiment, a precison alignment of the stabilizer 213 relative to the tape head 211 is necessary. On the other hand, this alignment process can be used to compensate for variability in the formation of stabilizer 213 or tape head 211, while providing proper alignment between these two components. For present embodiment, a product specified alignment tool is recommended for the alignment process to ensure that the distance, angle and relative height are controlled between stablizer 213 and tape head 211.
[0018] The bonding of stabilizer block 203B to tape head block 203 Ais preferably achieved using a high strength adhesive, such as UV glue. However, many bonding techniques known in the art may be used effectively depending on the materials used. Example alternative techniques are welding and soldering.
[0019] The final assembly 220 is shown in Figure 8. In this assembly, the profiles 212 and 214 of tape head 211 and stabilizer 213, respectively, are optimal for their respective functions. In addition, because stabilizer 213 is specifically aligned at the last step of assembly, the over-wrap angle 224 at the point where the tape 222 moves onto tape head 211 can be precisely controlled. This improves performance by minimizing the air bearing formed on tape head 211 as tape 222 moves across tape head 211.
[0020] Although specific embodiments of the invention are described herein, they are not to be construed as limiting the scope of the invention. Many other embodiments of the invention will become apparent to those skilled in the art in light of the teachings of this application. For example, although the embodiments described herein show the use of alignment tool , many other suitable techniques will be come apparent to those skilled in the art in light of the teaching of this specification. Each of these alternative embodiments and others are considered within the scope of the invention. The scope of the invention is limited only by the claims appended hereto.

Claims

WHAT IS CLAIMED IS:
JL _ A method for forming a tape head assembly comprising: forming a tape head having a first profile and having an stabilizer head interface area; forming a stabilizer head having a second profile and having a tape head interface area; and bonding the stabilizer head interface area to the tape head interface area such that the tape head and the stabilizer head have a desired configuration relative to each other and such that a gap is formed between the tape head and the stabilizer head.
2. A method as in claim 1 wherein the stabilizer head interface area to the tape head interface area are adhesively bonded.
3. A method as in claim 1 wherein the stabilizer head interface area to the tape head interface area are soldered.
4. A method as in claim 1 wherein the stabilizer head interface area to the tape head interface area are welded.
5. A method as in claim 1 wherein the tape head is primarily composed of alumina titanium carbide.
6. A method as in claim 1 wherein the stabilizer head is primarily composed of alumina titanium carbide.
7. A method as in claim 1 wherein the stabilizer head interface includes an alignment feature and the tape head alignment interface includes a complementary alignment feature.
8. A method as in claim 7 wherein the alignment feature is a bump and the complementary alignment feature is a concavity.
9. A method for forming a tape head assembly comprising; forming a ceramic tape head having a first profile and having an stabilizer head interfaceiarea including an alignment feature; forming a ceramic stabilizer head having a second profile and having a tape head interface area including a complementary alignment feature; and adhesively bonding the stabilizer head interface area to the tape head interface area such that the tape head and the stabilizer head are aligned according to the alignment feature and the complementary alignment feature.
10. A method as in claim 9 wherein the tape head is primarily composed of alumina titanium carbide.
11. A method as in claim 9 wherein the stabilizer head is primarily composed of alumina titanium carbide.
12. A tape head assembly comprising: a tape head having a first profile and having an stabilizer head interface area; a stabilizer head having a second profile and having a tape head interface area; and wherein the stabilizer head interface area and the tape head interface area are bonded such that the tape head and the stabilizer head have a desired configuration relative to each other and such that a gap is formed between the tape head and the stabilizer head.
13. A tape head assembly claim 12 wherein the stabilizer head interface area to the tape head interface area is adhesively bonded.
14. A tape head assembly as in claim 12 wherein the stabilizer head interface area to the tape head interface area is bonded by soldering.
15. A tape head assembly as in claim 12 wherein the stabilizer head interface area to the tape head interface area are bonded by welding.
16. A tape head assembly as in claim 12 wherein the tape head is primarily composed of alumina titanium carbide.
17. A tape head assembly as in claim 12 wherein the stabilizer head is primarily composed of alumina titanium carbide.
18. A tape head assembly as in claim 12 wherein the stabilizer head interface includes an alignment feature and the tape head alignment interface includes a complementary alignment feature.
19. A tape head assembly as in claim 18 wherein the alignment feature is a bump and the complementary alignment feature is a concavity.
20. A tape head assembly comprising: a ceramic tape head having a first profile and having an stabilizer head interface area including an alignment feature; a ceramic stabilizer head having a second profile and having a tape head interface area including a complementary alignment feature; and wherein the stabilizer head interface area and the tape head interface area are adhesively bonded such that the tape head and the stabilizer head are aligned according to the alignment feature and the complementary alignment feature.
21. A tape head assembly in claim 20 wherein the tape head is primarily composed of alumina titanium carbide.
22. A tape head assembly as in claim 20 wherein the stabilizer head is primarily composed of alumina titanium carbide.
PCT/CN2008/000144 2007-01-22 2008-01-21 Tape head method and assembly utilizing split tape stabilizer design WO2008089665A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US88173807P 2007-01-22 2007-01-22
US60/881,738 2007-01-22

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10395675B1 (en) 2018-03-26 2019-08-27 International Business Machines Corporation Stress-free tape head module
US11189306B1 (en) 2020-12-08 2021-11-30 International Business Machines Corporation Reduced-stress tape head module

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JPH09282743A (en) * 1996-04-17 1997-10-31 Sony Corp Recording and reproducing device
US5917684A (en) * 1995-05-22 1999-06-29 Sony Corporation Magnetic head apparatus, tape cartridge and recording/reproducing apparatus for increasing tape stability
US6018444A (en) * 1997-10-28 2000-01-25 Hewlett-Packard Company Batch fabricated servo write head having low write-gap linewidth variation
US6151191A (en) * 1997-03-11 2000-11-21 Massachusetts Institute Of Technology Helical scan recording with a self-acting negative air bearing
US20050168874A1 (en) * 2004-01-30 2005-08-04 International Business Machines Embedded chip tape head
JP2006120276A (en) * 2004-10-25 2006-05-11 Sony Corp Magnetic head and method of manufacturing same
CN1920955A (en) * 2005-08-26 2007-02-28 国际商业机器公司 Magnetic head with planar outrigger, tape drive system and forming method thereof

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0569751A2 (en) * 1992-05-14 1993-11-18 Datatape Incorporated Magnetic tape threading and transport apparatus including air bearing blocks
US5917684A (en) * 1995-05-22 1999-06-29 Sony Corporation Magnetic head apparatus, tape cartridge and recording/reproducing apparatus for increasing tape stability
JPH09282743A (en) * 1996-04-17 1997-10-31 Sony Corp Recording and reproducing device
US6151191A (en) * 1997-03-11 2000-11-21 Massachusetts Institute Of Technology Helical scan recording with a self-acting negative air bearing
US6018444A (en) * 1997-10-28 2000-01-25 Hewlett-Packard Company Batch fabricated servo write head having low write-gap linewidth variation
US20050168874A1 (en) * 2004-01-30 2005-08-04 International Business Machines Embedded chip tape head
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Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10395675B1 (en) 2018-03-26 2019-08-27 International Business Machines Corporation Stress-free tape head module
US10607637B2 (en) 2018-03-26 2020-03-31 International Business Machines Corporation Stress-free tape head module
US10770099B2 (en) 2018-03-26 2020-09-08 International Business Machines Corporation Stress-free tape head module
US10783905B2 (en) 2018-03-26 2020-09-22 International Business Machines Corporation Stress-free tape head module
US11189306B1 (en) 2020-12-08 2021-11-30 International Business Machines Corporation Reduced-stress tape head module

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